TY - GEN
T1 - Systems design of a high resolution retinal prosthesis
AU - Weiland, James D.
AU - Fink, Wolfgang
AU - Humayun, Mark S.
AU - Liu, Wentai
AU - Li, Wen
AU - Sivaprakasam, Mohanasankar
AU - Tai, Yu Chong
AU - Tarbell, Mark A.
PY - 2008/12/1
Y1 - 2008/12/1
N2 - Simulations of artificial vision suggest that 1000 electrodes may be required to restore vision to individuals with diseases of the outer retina. In order to achieve such an implant, new technology is needed, since the state-of-the-art implantable neural stimulator has at most 22 contacts with neural tissue. Considerable progress has been made towards that goal with the development of image processing, microelectronics, and polymer based MEMS. An image processing system has been realized that is capable of real-time implementation of image decimation and filtering (for example, edge detection). Application specific integrated circuits (ASICs) have been designed and tested to demonstrate closed loop power control and efficient microstimulation. A novel packaging process has been developed that is capable of simultaneously forming communication coils, interconnects, and stimulating electrodes.
AB - Simulations of artificial vision suggest that 1000 electrodes may be required to restore vision to individuals with diseases of the outer retina. In order to achieve such an implant, new technology is needed, since the state-of-the-art implantable neural stimulator has at most 22 contacts with neural tissue. Considerable progress has been made towards that goal with the development of image processing, microelectronics, and polymer based MEMS. An image processing system has been realized that is capable of real-time implementation of image decimation and filtering (for example, edge detection). Application specific integrated circuits (ASICs) have been designed and tested to demonstrate closed loop power control and efficient microstimulation. A novel packaging process has been developed that is capable of simultaneously forming communication coils, interconnects, and stimulating electrodes.
UR - https://www.scopus.com/pages/publications/78650760375
UR - https://www.scopus.com/pages/publications/78650760375#tab=citedBy
U2 - 10.1109/IEDM.2008.4796682
DO - 10.1109/IEDM.2008.4796682
M3 - Conference contribution
AN - SCOPUS:78650760375
SN - 9781424423781
T3 - Technical Digest - International Electron Devices Meeting, IEDM
BT - 2008 IEEE International Electron Devices Meeting, IEDM 2008
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2008 IEEE International Electron Devices Meeting, IEDM 2008
Y2 - 15 December 2008 through 17 December 2008
ER -