The application of carbon black and printing ink technology in molded interconnect devices

Ren Hao Liu, Wen Bin Young

研究成果: Article同行評審

4 引文 斯高帕斯(Scopus)

摘要

In this article, the processing of molded interconnect devices (MIDs) was studied via in-mold decoration (IMD) molding technology. A screen printing process using carbon black and printing ink was proposed in the study. For comparison, various conductivity materials such as copper powder, iron powder, carbon black and silver composite were studied with the screen printing method. The results show that there is no electrical conductivity for the ink containing copper or iron powder up to 90% concentration. The low cost carbon black with printing ink was shown to be successful for the IMD process.

原文English
頁(從 - 到)395-403
頁數9
期刊Journal of Polymer Engineering
34
發行號5
DOIs
出版狀態Published - 2014 七月 1

All Science Journal Classification (ASJC) codes

  • 化學工程 (全部)
  • 聚合物和塑料
  • 材料化學

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