The application of electrochemical metrologies for investigating chemical mechanical polishing of Al with a Ti barrier layer

Shao Yu Chiu, Ying Lang Wang, Chuan Pu Liu, Jin Kun Lan, Chyung Ay, Ming Shiann Feng, Ming Shih Tsai, Bau Tong Dai

研究成果: Article同行評審

19 引文 斯高帕斯(Scopus)

摘要

In situ electrochemical measurements were performed for Al and Ti disks in various slurries during polishing and static conditions. The electrochemical results obtained from the corrosion potential drop of Al polishing have verified that the maximum removal rate of metal CMP can be achieved when the removal rate of the surface oxide was equal to its growth rate. However, Ti polishing did not exist maximum removal rate. The effects of H2O 2%, pH values and pressure on the Al and Ti polishing behaviors were explored by using potentiodynamic scan. The corrosion potential drop was found to be a good index for polishing removal rate. The corrosion potential drop changed with increasing H2O2% for Al polishing and there existed a maximum value. But the corrosion potential drop increased with increasing H2O2% for Ti polishing. The pH value had different effects on Al and Ti polishing. Higher pH values gave higher Al removal rate but lower Ti removal rate. The Al polishing showed more pressure sensitive than Ti polishing did. The galvanic current was measured for Al/Ti polishing. For slurry with 6vol.% H2O2 and pH = 4, the abraded Al electrode obtained a negative current, which implied Ti oxidation was enhanced.

原文English
頁(從 - 到)444-451
頁數8
期刊Materials Chemistry and Physics
82
發行號2
DOIs
出版狀態Published - 2003 十一月 15

All Science Journal Classification (ASJC) codes

  • 材料科學(全部)
  • 凝聚態物理學

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