The Blech effect revisited - an in-situ study

Shih Kang Lin, Yu Chen Liu, Kuan Hsueh Lin

研究成果: Conference contribution

摘要

Blech critical product (BCP) is the product of the metal strip length times its current density passing through, and has served as the threshold for electromigration occurrence. The validity of BCP is still under debates. In this study, we employed in situ synchrotron radiation-based X-ray diffraction, ex situ scanning electron microscopic and transmission electron microscopic analyses to revisit BCP for aluminum strip. We proposed a new mechanism based on electric current-dislocation interaction and stress relaxation to revisit the BCP mechanism. The abnormal microstructures from microscopic analysis support the perspective where a series of complicated defect dynamics process involved in stress relaxation including recovery, recrystallization and grain growth.

原文English
主出版物標題2022 International Conference on Electronics Packaging, ICEP 2022
發行者Institute of Electrical and Electronics Engineers Inc.
頁面205-206
頁數2
ISBN(電子)9784991191138
DOIs
出版狀態Published - 2022
事件21st International Conference on Electronics Packaging, ICEP 2022 - Sapporo, Japan
持續時間: 2022 5月 112022 5月 14

出版系列

名字2022 International Conference on Electronics Packaging, ICEP 2022

Conference

Conference21st International Conference on Electronics Packaging, ICEP 2022
國家/地區Japan
城市Sapporo
期間22-05-1122-05-14

All Science Journal Classification (ASJC) codes

  • 製程化學與技術
  • 電氣與電子工程
  • 工業與製造工程
  • 電子、光磁材料

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