The comparative study of thermal stability among silicon dioxide, fluorinated silicate glass, hydrogen silsesquioxane, and organosilicate glass dielectrics on silicon

Chemical Compounds

• Annealing 45%
• Decomposition 7%
• Dielectric Material 71%
• Glass 56%
• Hydrogen 41%
• Liquid Film 5%
• Methyl Group 9%
• Oxygen Atom 9%
• Porosity 6%
• Secondary Ion Mass Spectroscopy 12%
• Silicate Glass 99%
• Silicon Dioxide 99%
• Silsesquioxane 100%
• Thermal Stability 53%
• Vacuum 9%

Engineering & Materials Science

• Annealing 57%
• Atoms 24%
• Copper 9%
• Decomposition 8%
• Glass 64%
• Hot Temperature 5%
• Hydrogen 64%
• Secondary ion mass spectrometry 17%
• Silica 83%
• Silicates 94%
• Silicon 64%
• Surface roughness 9%
• Thermodynamic stability 84%
• Vacuum 10%

Physics & Astronomy

• annealing 34%
• atoms 5%
• copper 8%
• decomposition 8%
• glass 47%
• hydrogen 50%
• oxygen atoms 12%
• penetration 9%
• plateaus 10%
• profiles 6%
• roughness 9%
• secondary ion mass spectrometry 11%
• silicates 79%
• silicon 43%
• silicon dioxide 62%
• thermal stability 71%
• vacuum 7%