The composition and microstructure of electrodeposited solder on electroless nickel in the presence of gelatine

Kwang Lung Lin, Jieh Ting Chang

研究成果: Article同行評審

4 引文 斯高帕斯(Scopus)

摘要

The effect of gelatine addition to the electrodeposition bath on the tin content of the solder deposits was investigated. The results showed that as little as 0.5 gl-1 gelatine greatly enhanced the tin content of the deposits. The maximum tin content achievable for the deposit was approximately equal to the percentage of tin in the deposition bath. A lower current density and a greater metal content of the deposition bath tended to offset the effect of gelatine in promoting tin content of the deposit. Gelatine was found, with the aid of scanning electron microscopy and X-ray diffractometry, strongly to affect the morphology and facet orientation of the deposits.

原文English
頁(從 - 到)1879-1883
頁數5
期刊Journal of Materials Science
30
發行號7
DOIs
出版狀態Published - 1995 一月 1

All Science Journal Classification (ASJC) codes

  • 材料科學(全部)
  • 材料力學
  • 機械工業

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