The development of a new contact type piezoresistive micro-shear-stress sensor

M. C. Hsieh, Y. K. Fang, M. S. Ju, J. J. Ho, S. F. Ting

研究成果: Conference article同行評審

7 引文 斯高帕斯(Scopus)

摘要

A prototype contact type micro piezoresistive shear-stress sensor that can be utilized to measure the shear stress between skin of stump and socket of Above-Knee (AK) prosthesis was designed, fabricated and tested. Micro-electro-mechanical system (MEMS) technology has been chosen for the design because of the low cost, small size and adaptability to this application. In this paper, the Finite Element Method (FEM) package ANSYS has been employed for the stress analysis of the micro shear-stress sensors. The sensors contain two X-ducers that will transform the stresses into an output voltage. In the developed sensor, a 3000×3000×300 μm3 square membrane is formed by bulk micromaching of an n-type 〈100〉 monolithic silicon. The piezoresistive strain gauges were implanted with boron ions with a dose of 1015 atoms/cm2. Static characteristics of the shear sensor were determined through a series of calibration tests. The fabricated sensor exhibits a sensitivity of 0.13 mV/mA-MPa for a 1.4 N full scales shear force range and the overall mean hysteresis error is than 3.5%. In addition, the results simulated by FEM are validated by comparison with experimental investigations.

原文English
頁(從 - 到)285-295
頁數11
期刊Proceedings of SPIE - The International Society for Optical Engineering
4755
DOIs
出版狀態Published - 2002
事件Design, Test, Integration, and packaging of MEMS/MOEMS 2002 - Cannes, France
持續時間: 2002 五月 62002 五月 8

All Science Journal Classification (ASJC) codes

  • 電子、光磁材料
  • 凝聚態物理學
  • 電腦科學應用
  • 應用數學
  • 電氣與電子工程

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