TY - GEN
T1 - The development of the performance measuring system for the phase change heat transport device-heat pipe, vapor chamber and defrost plate
AU - Lin, Wei Keng
AU - Chao, Chen I.
AU - Tzou, Y. M.
AU - Chang, H. G.H.
AU - Wang, Paul
PY - 2011
Y1 - 2011
N2 - A multipurpose of the performance measuring system for the phase change heat transport device such as heat pipe, vapor chamber and defrost plate was designed in this study. The characteristic of this measuring system was using thermal electrical chip (T.E.C.) as the condenser. This paper also present experimental measurement of performance of a vapor chamber (VC), heat pipe and defrost plate. The vapor chamber, with square sides of 50 × 50mm and thickness of 3.5mm and 6mm, was sandwiched between a heater block and a cooling plate located on the evaporator and the condenser surface respectively. The performance of the vapor chamber was investigated by determining the thermal resistance over a heat input range of 1 to 5W in natural convection test with the condenser opens at ambient environment and up to 40W in force convection with the condenser held at constant temperature. The experimental results show that the Maximum heat dissipated ability was the same compare with the new design measuring system and the traditional heat pipe performance measuring system with a water jacket as the cooling condenser. The thermal resistance in natural convection condition for the axial direction was around 0.1°C/W, while the spray thermal resistance was 0.12°C/W. For the defrost plate, the axial thermal resistance was 0.17°C/W and 0.18°C/W for the spray thermal resistance.
AB - A multipurpose of the performance measuring system for the phase change heat transport device such as heat pipe, vapor chamber and defrost plate was designed in this study. The characteristic of this measuring system was using thermal electrical chip (T.E.C.) as the condenser. This paper also present experimental measurement of performance of a vapor chamber (VC), heat pipe and defrost plate. The vapor chamber, with square sides of 50 × 50mm and thickness of 3.5mm and 6mm, was sandwiched between a heater block and a cooling plate located on the evaporator and the condenser surface respectively. The performance of the vapor chamber was investigated by determining the thermal resistance over a heat input range of 1 to 5W in natural convection test with the condenser opens at ambient environment and up to 40W in force convection with the condenser held at constant temperature. The experimental results show that the Maximum heat dissipated ability was the same compare with the new design measuring system and the traditional heat pipe performance measuring system with a water jacket as the cooling condenser. The thermal resistance in natural convection condition for the axial direction was around 0.1°C/W, while the spray thermal resistance was 0.12°C/W. For the defrost plate, the axial thermal resistance was 0.17°C/W and 0.18°C/W for the spray thermal resistance.
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U2 - 10.1109/IMPACT.2011.6117272
DO - 10.1109/IMPACT.2011.6117272
M3 - Conference contribution
AN - SCOPUS:84863166209
SN - 9781457713880
T3 - Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT
SP - 253
EP - 256
BT - 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2011
T2 - 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2011
Y2 - 18 October 2011 through 21 October 2011
ER -