The development of the performance measuring system for the phase change heat transport device-heat pipe, vapor chamber and defrost plate

Wei Keng Lin, Chen I. Chao, Y. M. Tzou, H. G.H. Chang, Hong-Paul Wang

研究成果: Conference contribution

2 引文 斯高帕斯(Scopus)

摘要

A multipurpose of the performance measuring system for the phase change heat transport device such as heat pipe, vapor chamber and defrost plate was designed in this study. The characteristic of this measuring system was using thermal electrical chip (T.E.C.) as the condenser. This paper also present experimental measurement of performance of a vapor chamber (VC), heat pipe and defrost plate. The vapor chamber, with square sides of 50 × 50mm and thickness of 3.5mm and 6mm, was sandwiched between a heater block and a cooling plate located on the evaporator and the condenser surface respectively. The performance of the vapor chamber was investigated by determining the thermal resistance over a heat input range of 1 to 5W in natural convection test with the condenser opens at ambient environment and up to 40W in force convection with the condenser held at constant temperature. The experimental results show that the Maximum heat dissipated ability was the same compare with the new design measuring system and the traditional heat pipe performance measuring system with a water jacket as the cooling condenser. The thermal resistance in natural convection condition for the axial direction was around 0.1°C/W, while the spray thermal resistance was 0.12°C/W. For the defrost plate, the axial thermal resistance was 0.17°C/W and 0.18°C/W for the spray thermal resistance.

原文English
主出版物標題2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2011
頁面253-256
頁數4
DOIs
出版狀態Published - 2011 12月 1
事件2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2011 - Taipei, Taiwan
持續時間: 2011 10月 182011 10月 21

出版系列

名字Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT
ISSN(列印)2150-5934
ISSN(電子)2150-5942

Other

Other2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2011
國家/地區Taiwan
城市Taipei
期間11-10-1811-10-21

All Science Journal Classification (ASJC) codes

  • 硬體和架構
  • 控制與系統工程
  • 電氣與電子工程

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