The effective permeability of the underfill flow domain in flip-chip packaging

Connie Yang, Wen Bin Young

研究成果: Article同行評審

12 引文 斯高帕斯(Scopus)

指紋

深入研究「The effective permeability of the underfill flow domain in flip-chip packaging」主題。共同形成了獨特的指紋。

Mathematics

Engineering & Materials Science