The effects of cracks on the thermal stress induced by soldering in monocrystalline silicon cells

Chi-ming Lai, Keh Moh Lin, Chi Hung Su

研究成果: Article同行評審

7 引文 斯高帕斯(Scopus)

摘要

Silicon-based solar applications have tended towards the use of large, thin cells. However, an increased loss of materials occurs due to a high rate of destruction during the soldering and packaging processes. In this study, the effects of the presence of cracks on the thermal stress and stress intensity factor of the cells were explored for different aspect ratios of the soldering rods using an established finite element method. It was found that the residual stress in the cell was concentrated near the ends of the soldering rods, which coincided with the typical positions where breakage tended to occur on the cell. The residual stress on the cell increased with an increasing aspect ratio of the soldering rod. Cell damage due to cracking can be avoided by controlling the magnitude of the soldering rod's aspect ratio.

原文English
頁(從 - 到)127-135
頁數9
期刊Proceedings of the Institution of Mechanical Engineers, Part E: Journal of Process Mechanical Engineering
228
發行號2
DOIs
出版狀態Published - 2014 一月 1

All Science Journal Classification (ASJC) codes

  • 機械工業
  • 工業與製造工程

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