The effects of gallium additions on microstructures and thermal and mechanical properties of Sn-9Zn solder alloys

Kang I. Chen, Shou C. Cheng, Chin H. Cheng, Sean Wu, Yeu L. Jiang, Tsung C. Cheng

研究成果: Article同行評審

12 引文 斯高帕斯(Scopus)

摘要

The effects of gallium additions on microstructures and thermal and mechanical properties of the Sn-9Zn solder alloys are investigated in this study. The results show that the melting temperature of the alloys decreases with the increase in the Ga concentration, while the pasty ranges of the alloys are simultaneously enlarged. By adding a 0.25-0.5 wt.% Ga element, the Sn-matrix region is slightly increased and the Zn-rich phase becomes slightly coarser; however, the overall microstructure is still very similar to that of the Sn-9Zn alloy. It is found that, when the Ga concentration is less than 0.50 wt.%, the ultimate tensile strength and elongation are maintained at the same values. The addition of a 0.25-0.50 wt.% Ga to the Sn-9Zn alloy also leads to small cup and cone fracture surfaces which exhibit near-complete ductile fracturing. With the addition being increased to 0.75 wt.%, larger cup and cone fractures are observed. The 1.00 wt.% Ga alloy has lower strength and ductility due to the coarser and nonuniform microstructures. However, the fracture surfaces of the 1.00 wt.% Ga alloy show partial cleavage and a partially dimpled fracture.

原文English
文章編號606814
期刊Advances in Materials Science and Engineering
2014
DOIs
出版狀態Published - 2014

All Science Journal Classification (ASJC) codes

  • 材料科學(全部)
  • 工程 (全部)

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