The effects of small additions Ga and Al on the microstructure and tensile properties of Sn-Zn based lead-free solders

Kang I. Chen, Shou Chang Cheng, Chin Hsiang Cheng

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)

摘要

The melting temperature, microstructures, and mechanical properties of the Sn-Zn-0.5Ag-0.5Ga, Sn-Zn-0.5Ag-0.45Al and Sn-Zn-0.5Ga-0.45Al lead-free solders were investigated. The results indicate that the addition of 0.5 wt% Ag to the Sn-Zn based alloys destroy the eutectic structure and results in the formation of Ag-Zn compound and hypoeutectic structure. The variation in the microstructure lowers the UTS. By the addition of Al the UTS and elongation of the 0.5Ag-0.45Al alloy can be decreased due to the Al diffused to the interface of the Ag-Zn compound/Sn-Zn eutectic structure to form Al-Zn compound. The 0.5Ga-0.45Al alloy shows a typical eutectic structure with the light contract ß-Sn and the darker needle-like phase, as well as a small amount of Al-Zn phase with a near diamond shape. Gallium uniformly distributes in the Sn matrix and Zn rich phases. The 0.5Ga-0.45Al solder had the highest UTS and elongation, while 0.5Ag-0.45Al had the lowest UTS and elongation. The results indicate that Ga and Al exhibits prominent influence on the microstructure as well as the mechanical properties of the solders.

原文English
主出版物標題Recent Development on Material Science and Environmental Material
頁面265-270
頁數6
DOIs
出版狀態Published - 2013
事件2013 International Conference on Application of Materials Science and Environmental Materials, AMSEM 2013 - Zhangjia Jie, China
持續時間: 2013 七月 52013 七月 7

出版系列

名字Advanced Materials Research
800
ISSN(列印)1022-6680

Other

Other2013 International Conference on Application of Materials Science and Environmental Materials, AMSEM 2013
國家China
城市Zhangjia Jie
期間13-07-0513-07-07

All Science Journal Classification (ASJC) codes

  • Engineering(all)

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