The electromigration investigation on the newly developed Pb-free Sn-Zn-Ag-Al-Ga solder ball interconnect

Kwang Lung Lin, Ger Pin Lin

研究成果: Conference contribution

摘要

A Sn-Zn based eutectic solder with a relatively lower melting temperature and cost was under investigation for its response to electrical current stressing. The BGA (ball grid array) joint was produced with the Sn-8.5Zn-0.5Ag-0.01Al-0.1Ga solder ball. The solder joint was supplied from industry and was produced to interconnect PCB and BGA substrate on which the metallization layers are Cu (30-35 um)/Ni (10 urn)/Au (0.2-1 urn). The investigation was conducted under air at 120°C in a furnace with a current density in the order of 10-3 A/cm2. Voids were found in th solder near the metallization of the PCB side when the electron flows outward the PCB. Meanwhile, the IMC (AuZn3 and AgZ3) formed on the substrate side during reflow was decomposed after current stressing. The decomposition results in the reformation of Zn-Ag-Zu IMC within the solder. Delta-NiZn compound was also detected within the solder, of which the Ni may come from the Cu/Ni/Au metallization layer. The Ni was also found to form NiGa compound within the solder. Hillocks were found for the IMC layer regardless of the direction of electrical current.

原文English
主出版物標題Proceedings - 57th Electronic Components and Technology Conference 2007, ECTC '07
頁面1467-1471
頁數5
DOIs
出版狀態Published - 2007 十月 22
事件57th Electronic Components and Technology Conference 2007, ECTC '07 - Sparks, NV, United States
持續時間: 2007 五月 292007 六月 1

出版系列

名字Proceedings - Electronic Components and Technology Conference
ISSN(列印)0569-5503

Other

Other57th Electronic Components and Technology Conference 2007, ECTC '07
國家United States
城市Sparks, NV
期間07-05-2907-06-01

    指紋

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

引用此

Lin, K. L., & Lin, G. P. (2007). The electromigration investigation on the newly developed Pb-free Sn-Zn-Ag-Al-Ga solder ball interconnect. 於 Proceedings - 57th Electronic Components and Technology Conference 2007, ECTC '07 (頁 1467-1471). [4250075] (Proceedings - Electronic Components and Technology Conference). https://doi.org/10.1109/ECTC.2007.373989