The electrothermal fracture mechanism between aluminum and copper wires

Chemical Compounds

• Resistance 77%
• Eutectics 71%
• Surface Temperature 45%
• Length 31%
• Wire Drawing 30%
• Voltage 25%
• Crystal Twinning 25%
• Embrittlement 23%
• Cladding 22%
• Ductility 20%
• Solidification 19%
• Liquid 19%
• Corrosion Resistance 15%
• Heat Treatment 14%
• Electrical Property 14%
• Annealing 13%
• Thermal Stability 11%
• Strength 11%
• Purity 8%
• Crystal Structure 8%
• Amount 7%

Engineering & Materials Science

• Copper 100%
• Aluminum 94%
• Wire 91%
• Eutectics 25%
• Crystal microstructure 15%
• Wire drawing 8%
• Liquids 8%
• Mechanical properties 7%
• Crystal structure 7%
• Embrittlement 7%
• Temperature 7%
• Electric properties 6%
• Thermodynamic stability 6%
• Electric potential 6%
• Annealing 6%
• Solidification 5%
• Nickel 5%
• Corrosion resistance 5%
• Heat treatment 5%
• Experiments 4%

Physics & Astronomy

• wire 91%
• copper 87%
• aluminum 84%
• eutectics 22%
• surface temperature 11%
• incandescence 8%
• mechanical properties 7%
• embrittlement 6%
• electric potential 6%
• liquids 6%
• tensile tests 6%
• corrosion resistance 5%
• ductility 5%
• solidification 5%
• thermal stability 5%
• heat treatment 4%
• nickel 4%
• occurrences 4%
• crystal structure 4%
• trends 4%
• electrical properties 4%
• damage 4%
• causes 3%
• annealing 3%