The failure mode of Bi and Ni-doped Sn-Ag-Cu solder joint under electromigration tests

T. C. Lin, H. Y. Kung, S. H. Lee, M. H. Chen, Y. T. Chiu, K. L. Lin

研究成果: Conference contribution

2 引文 斯高帕斯(Scopus)

摘要

The effects of minor alloying additions of Ni and Bi on the electromigration (EM) reliability and nanomechanical properties of Sn-Ag-Cu (SAC405 and SAC1205, noted as SAC) solder joints were investigated. The nanomechanical properties of the solders were measured by nanoindentation with the continuous contact stiffness (CSM) mode. The EM results indicated that the SAC-Ni solders exhibit better lifetime than others. The EM fracture behaviors of the solder joints were governed by the intermetallic compounds formed in the solder joints. The fracture occurred at the redistribution layer and under bump metallization/solder ball interface for SAC-Bi and SAC-Ni, respectively. Both the nanohardness and the elastic modulus of SAC solders are clearly enhanced by the minor alloying additions of Ni and Bi.

原文English
主出版物標題2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018
發行者Institute of Electrical and Electronics Engineers Inc.
頁面226-229
頁數4
ISBN(電子)9784990218850
DOIs
出版狀態Published - 2018 六月 6
事件2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018 - Kuwana, Mie, Japan
持續時間: 2018 四月 172018 四月 21

出版系列

名字2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018

Other

Other2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018
國家/地區Japan
城市Kuwana, Mie
期間18-04-1718-04-21

All Science Journal Classification (ASJC) codes

  • 電氣與電子工程
  • 電子、光磁材料
  • 聚合物和塑料

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