The HOY tester - Can IC testing go wireless?

Cheng Wen Wu, Chih Tsun Huang, Shi Yu Huang, Po Chiun Huang, Tsin Yuan Chang, Yu Tsao Hsing

研究成果: Conference contribution

22 引文 斯高帕斯(Scopus)

摘要

Test cost is becoming a more and more significant portion of the cost structure in advanced semiconductor products. To address this issue, we propose HOY - a novel wireless test system with enhanced embedded test features. We present the concept, architecture, and test flow for future semiconductor products tested by HOY. Necessary technologies for the success of HOY also are presented, though most of which require further investigation. A preliminary demonstration system has been constructed, and experiments are being conducted.

原文English
主出版物標題2006 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2006 - Proceedings of Technical Papers
頁面183-186
頁數4
DOIs
出版狀態Published - 2007 10月 1
事件2006 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2006 - Hsinchu, Taiwan
持續時間: 2007 4月 262007 4月 28

出版系列

名字2006 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2006 - Proceedings of Technical Papers

Other

Other2006 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2006
國家/地區Taiwan
城市Hsinchu
期間07-04-2607-04-28

All Science Journal Classification (ASJC) codes

  • 硬體和架構
  • 電氣與電子工程

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