The influence of Cr-based coating on the adhesion force between epoxy molding compounds and IC encapsulation mold

S. M. Chiu, S. J. Hwang, C. W. Chu, Dershin Gan

研究成果: Article同行評審

68 引文 斯高帕斯(Scopus)

摘要

The surface properties of IC encapsulation molds such as anti-sticking, wear and corrosion resistances can be improved by hard surface coating. The unbalanced magnetron sputtering method is used to deposit Cr, Cr2N, and CrN phase individual. Of the three coatings, the Cr2N coating has the lowest surface energy and the highest contact angle of water, which reaches as high as 120°. High water-repellency of Cr2N coating is due to the CH groups on the film surface, and the N-H or O-H bonds are found to be the effective adsorption sites for carbon substances. The experimental results also show the correlation of coating's surface energy and its adhesion force with EMC. Performance evaluation showed that the Cr2N coating could increase the number of molding injections in the IC package production lines by 50%.

原文English
頁(從 - 到)285-292
頁數8
期刊Thin Solid Films
515
發行號1
DOIs
出版狀態Published - 2006 九月 25

All Science Journal Classification (ASJC) codes

  • 電子、光磁材料
  • 表面和介面
  • 表面、塗料和薄膜
  • 金屬和合金
  • 材料化學

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