The influence of Pd on the interfacial reactions between the Pd-plated Cu ball bond and Al pad

Yu Wei Lin, Wun Bin Ke, Ren You Wang, I. Sheng Wang, Ying Ta Chiu, Kuo Chang Lu, Kwang Lung Lin, Yi Shao Lai

研究成果: Article同行評審

15 引文 斯高帕斯(Scopus)

摘要

The interfacial reactions of the Pd-plated Cu (Pd-Cu) ball bond and 4N Cu (Cu) ball bond on Al were investigated through PCT (Pressure Cooker Test) and HTST (High Temperature Storage Test) tests. The thickness of the interfacial Cu-Al IMC increases as the testing time increases. The Cu. Al IMC growth rate was found to be slower in the Pd. Cu ball bond than in the Cu ball bond. The growth of the IMC is diffusion-controlled during aging. During the test, the Pd diffuses from the interior of the Pd. Cu ball toward the bond interface. FIB (Focus Ion Beam) studies show crack formation at the Cu. Al IMC/Al interface in the Cu ball bond. During aging, the Pd-rich layer affected the interdiffusion between Cu and Al and may influence the IMC formation. The Pd. Cu ball bond showed better bonding reliability than the Cu ball bond in all tests.

原文English
頁(從 - 到)599-603
頁數5
期刊Surface and Coatings Technology
231
DOIs
出版狀態Published - 2013 九月 25

All Science Journal Classification (ASJC) codes

  • 化學 (全部)
  • 凝聚態物理學
  • 表面和介面
  • 表面、塗料和薄膜
  • 材料化學

指紋

深入研究「The influence of Pd on the interfacial reactions between the Pd-plated Cu ball bond and Al pad」主題。共同形成了獨特的指紋。

引用此