The influences of moisture and fluorine on the characteristics of fluorinated silicate glass for copper metallization

Ching Chun Chang, Shiu Ko JangJian, J. S. Chen

研究成果: Article同行評審

3 引文 斯高帕斯(Scopus)

摘要

In this study, the impacts of moisture and unstable fluorine on the fundamental properties of fluorinated silicate glass (FSG) are discussed. Specific thermal treatment and water-soaking treatment are applied to the FSG dielectric layer. The influences of the moisture and fluorine outgassing from the FSG layers on the integrity of the Cu/TaN x∼0.5/Ta/FSG/ 〈Si〉 multilayer structure are investigated using transmission electron microscopy, Rutherford backscattering spectroscopy, and secondary ion mass spectroscopy. The results indicate that the formation of voids at the interface between the metallization layer and FSG film is correlated with the moisture and unstable fluorine in the FSG dielectric layer. Nevertheless, both of them can be eliminated by baking the FSG dielectrics prior to the subsequent metallization. Meanwhile, the dielectric constant and leakage current characteristics of the FSG film can be improved by driving out the moisture and unstable fluorine of the dielectric layer after baking in N 2 at ambient conditions.

原文English
頁(從 - 到)G901-G905
期刊Journal of the Electrochemical Society
153
發行號10
DOIs
出版狀態Published - 2006

All Science Journal Classification (ASJC) codes

  • 電子、光磁材料
  • 可再生能源、永續發展與環境
  • 表面、塗料和薄膜
  • 電化學
  • 材料化學

指紋

深入研究「The influences of moisture and fluorine on the characteristics of fluorinated silicate glass for copper metallization」主題。共同形成了獨特的指紋。

引用此