The interdiffusion and interphases formed between electroless nickel deposit and steel substrate

研究成果: Article › 同行評審

原文	English
頁（從 - 到）	667-672
頁數	6
期刊	Scripta Metallurgica et Materiala
卷	29
發行號	5
DOIs	https://doi.org/10.1016/0956-716X(93)90416-P
出版狀態	Published - 1993 9月 1

All Science Journal Classification (ASJC) codes

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title = "The interdiffusion and interphases formed between electroless nickel deposit and steel substrate",

author = "Lin, {Kwang Lung} and Chen, {Wei Cheng}",

year = "1993",

month = sep,

day = "1",

doi = "10.1016/0956-716X(93)90416-P",

language = "English",

volume = "29",

pages = "667--672",

journal = "Scripta Metallurgica et Materiala",

issn = "0956-716X",

publisher = "Elsevier Limited",

number = "5",

}

TY - JOUR

T1 - The interdiffusion and interphases formed between electroless nickel deposit and steel substrate

AU - Lin, Kwang Lung

AU - Chen, Wei Cheng

PY - 1993/9/1

Y1 - 1993/9/1

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U2 - 10.1016/0956-716X(93)90416-P

DO - 10.1016/0956-716X(93)90416-P

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VL - 29

SP - 667

EP - 672

JO - Scripta Metallurgica et Materiala

JF - Scripta Metallurgica et Materiala

IS - 5

ER -