The interface microstructure on the reliability of flip-chip laser diode bonding

Chien Chih Liu, Yen Kuang Lin, Mau-phon Houng, Yeong-Her Wang

研究成果: Conference contribution

摘要

We have successfully developed a fluxless bonding process to manufacture In-Au microjoint between laser diode and silicon substrate, and studied the interface properties and microstructure of In-Au layer. From XRD, SEM and EDX results indicate that AuIn2 is the main intermetallic phase, which plays an important role on the quality of joints. To study the thermal stability, the flip-chip assemblies were then tested by thermal shock and high temperature storage. From the thermal shock test, we can find that high bonding temperature will result in failure mode, such as the occurrence of cracks at the grain boundary. From thermal aging test, no brittle intermetallic phases and fractures were observed in the solder joints. Therefore, the bonding process has to be optimized because the reliability of solder joint strongly depended on the initial microstructure. The optimal bonding temperature is 200°C after thermal shock test and high temperature storage test.

原文English
主出版物標題Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002
發行者Institute of Electrical and Electronics Engineers Inc.
頁面438-444
頁數7
ISBN(電子)078037682X, 9780780376823
DOIs
出版狀態Published - 2002 一月 1
事件4th International Symposium on Electronic Materials and Packaging, EMAP 2002 - Kaohsiung, Taiwan
持續時間: 2002 十二月 42002 十二月 6

出版系列

名字Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002

Other

Other4th International Symposium on Electronic Materials and Packaging, EMAP 2002
國家Taiwan
城市Kaohsiung
期間02-12-0402-12-06

指紋

Semiconductor lasers
Thermal shock
Microstructure
Soldering alloys
Intermetallics
Temperature
Thermal aging
Silicon
Failure modes
Energy dispersive spectroscopy
Grain boundaries
Thermodynamic stability
Cracks
Scanning electron microscopy
Substrates

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Materials Science(all)

引用此文

Liu, C. C., Lin, Y. K., Houng, M., & Wang, Y-H. (2002). The interface microstructure on the reliability of flip-chip laser diode bonding. 於 Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002 (頁 438-444). [1188879] (Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EMAP.2002.1188879
Liu, Chien Chih ; Lin, Yen Kuang ; Houng, Mau-phon ; Wang, Yeong-Her. / The interface microstructure on the reliability of flip-chip laser diode bonding. Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002. Institute of Electrical and Electronics Engineers Inc., 2002. 頁 438-444 (Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002).
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abstract = "We have successfully developed a fluxless bonding process to manufacture In-Au microjoint between laser diode and silicon substrate, and studied the interface properties and microstructure of In-Au layer. From XRD, SEM and EDX results indicate that AuIn2 is the main intermetallic phase, which plays an important role on the quality of joints. To study the thermal stability, the flip-chip assemblies were then tested by thermal shock and high temperature storage. From the thermal shock test, we can find that high bonding temperature will result in failure mode, such as the occurrence of cracks at the grain boundary. From thermal aging test, no brittle intermetallic phases and fractures were observed in the solder joints. Therefore, the bonding process has to be optimized because the reliability of solder joint strongly depended on the initial microstructure. The optimal bonding temperature is 200°C after thermal shock test and high temperature storage test.",
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Liu, CC, Lin, YK, Houng, M & Wang, Y-H 2002, The interface microstructure on the reliability of flip-chip laser diode bonding. 於 Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002., 1188879, Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002, Institute of Electrical and Electronics Engineers Inc., 頁 438-444, 4th International Symposium on Electronic Materials and Packaging, EMAP 2002, Kaohsiung, Taiwan, 02-12-04. https://doi.org/10.1109/EMAP.2002.1188879

The interface microstructure on the reliability of flip-chip laser diode bonding. / Liu, Chien Chih; Lin, Yen Kuang; Houng, Mau-phon; Wang, Yeong-Her.

Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002. Institute of Electrical and Electronics Engineers Inc., 2002. p. 438-444 1188879 (Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002).

研究成果: Conference contribution

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Liu CC, Lin YK, Houng M, Wang Y-H. The interface microstructure on the reliability of flip-chip laser diode bonding. 於 Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002. Institute of Electrical and Electronics Engineers Inc. 2002. p. 438-444. 1188879. (Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002). https://doi.org/10.1109/EMAP.2002.1188879