The interfacial amorphous double layer and the homogeneous nucleation in reflow of a Sn-Zn solder on Cu substrate

Chien Cheng Pan, Kwang Lung Lin

研究成果: Article同行評審

5 引文 斯高帕斯(Scopus)

摘要

To illustrate the interfacial reaction mechanism, the Sn-Zn[Sn-8.5Zn-0.5Ag- 0.01Al-0.1Ga (wt)] solder was reflowed on Cu substrate at 250 C for 15 s followed by immediate quench in liquid nitrogen. The frozen interfacial microstructure was investigated with high resolution transmission electron microscope. An amorphous double layer was formed at the interface which consists of a 5 nm pure Cu region and a Cu-Zn diffusion region. Nanocrystalline intermetallic compound (IMC) Cu5Zn8 were observed in the Cu-Zn diffusion region. These nanocrystalline IMCs are suggested to form via a homogeneous nucleation process.

原文English
文章編號103513
期刊Journal of Applied Physics
109
發行號10
DOIs
出版狀態Published - 2011 五月 15

All Science Journal Classification (ASJC) codes

  • 物理與天文學 (全部)

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