The interfacial amorphous double layer and the homogeneous nucleation in reflow of a Sn-Zn solder on Cu substrate

Chien Cheng Pan; Kwang Lung Lin

doi:10.1063/1.3592182

The interfacial amorphous double layer and the homogeneous nucleation in reflow of a Sn-Zn solder on Cu substrate

Chien Cheng Pan, Kwang Lung Lin

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5 引文斯高帕斯（Scopus）

摘要

To illustrate the interfacial reaction mechanism, the Sn-Zn[Sn-8.5Zn-0.5Ag- 0.01Al-0.1Ga (wt)] solder was reflowed on Cu substrate at 250 C for 15 s followed by immediate quench in liquid nitrogen. The frozen interfacial microstructure was investigated with high resolution transmission electron microscope. An amorphous double layer was formed at the interface which consists of a 5 nm pure Cu region and a Cu-Zn diffusion region. Nanocrystalline intermetallic compound (IMC) Cu₅Zn₈ were observed in the Cu-Zn diffusion region. These nanocrystalline IMCs are suggested to form via a homogeneous nucleation process.

原文	English
文章編號	103513
期刊	Journal of Applied Physics
卷	109
發行號	10
DOIs	https://doi.org/10.1063/1.3592182
出版狀態	Published - 2011 5月 15

All Science Journal Classification (ASJC) codes

一般物理與天文學

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10.1063/1.3592182

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title = "The interfacial amorphous double layer and the homogeneous nucleation in reflow of a Sn-Zn solder on Cu substrate",

abstract = "To illustrate the interfacial reaction mechanism, the Sn-Zn[Sn-8.5Zn-0.5Ag- 0.01Al-0.1Ga (wt)] solder was reflowed on Cu substrate at 250 C for 15 s followed by immediate quench in liquid nitrogen. The frozen interfacial microstructure was investigated with high resolution transmission electron microscope. An amorphous double layer was formed at the interface which consists of a 5 nm pure Cu region and a Cu-Zn diffusion region. Nanocrystalline intermetallic compound (IMC) Cu5Zn8 were observed in the Cu-Zn diffusion region. These nanocrystalline IMCs are suggested to form via a homogeneous nucleation process.",

author = "Pan, {Chien Cheng} and Lin, {Kwang Lung}",

note = "Funding Information: The authors acknowledge the National Science Council of the Republic of China (Taiwan) for the financial support of this study under Grant No. NSC 95-2221-E-006-032-MY3.",

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AU - Pan, Chien Cheng

AU - Lin, Kwang Lung

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N2 - To illustrate the interfacial reaction mechanism, the Sn-Zn[Sn-8.5Zn-0.5Ag- 0.01Al-0.1Ga (wt)] solder was reflowed on Cu substrate at 250 C for 15 s followed by immediate quench in liquid nitrogen. The frozen interfacial microstructure was investigated with high resolution transmission electron microscope. An amorphous double layer was formed at the interface which consists of a 5 nm pure Cu region and a Cu-Zn diffusion region. Nanocrystalline intermetallic compound (IMC) Cu5Zn8 were observed in the Cu-Zn diffusion region. These nanocrystalline IMCs are suggested to form via a homogeneous nucleation process.

AB - To illustrate the interfacial reaction mechanism, the Sn-Zn[Sn-8.5Zn-0.5Ag- 0.01Al-0.1Ga (wt)] solder was reflowed on Cu substrate at 250 C for 15 s followed by immediate quench in liquid nitrogen. The frozen interfacial microstructure was investigated with high resolution transmission electron microscope. An amorphous double layer was formed at the interface which consists of a 5 nm pure Cu region and a Cu-Zn diffusion region. Nanocrystalline intermetallic compound (IMC) Cu5Zn8 were observed in the Cu-Zn diffusion region. These nanocrystalline IMCs are suggested to form via a homogeneous nucleation process.

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The interfacial amorphous double layer and the homogeneous nucleation in reflow of a Sn-Zn solder on Cu substrate

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