The interfacial interaction of Ti/Ni/Ag/Au multilayer under thermal cycling test

Fu Jung Yeh, Tsung Chieh Chiu, Kwang-Lung Lin

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)

摘要

The Ti/Ni/Ag/Au multilayers combination, intended for LED metallization was deposited on Si substrate for interfacial interaction study. The interfacial interactions of the Ti/Ni/Ag/Au multilayers was investigated under various periods of thermal cycling between-40°C and 125°C. The results of ESCA (Electron Spectroscopy for Chemical Analysis) depth profile analysis indicate that Ag atoms diffuse passing through the pure Au layer to the surface after thermal cycling. The outward diffusion of Ag atoms towards Au and Ni cause voids formation in the Ag layer.

原文English
主出版物標題14th International Conference on Electronic Materials and Packaging, EMAP 2012
DOIs
出版狀態Published - 2012
事件14th International Conference on Electronic Materials and Packaging, EMAP 2012 - Lantau Island, Hong Kong
持續時間: 2012 十二月 132012 十二月 16

Other

Other14th International Conference on Electronic Materials and Packaging, EMAP 2012
國家Hong Kong
城市Lantau Island
期間12-12-1312-12-16

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials

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