The Interfacial Reaction between Sn-Zn-Ag-Ga-Al Solders and Metallized Cu Substrates

Chiang Ming Chuang, Hui Tzu Hung, Pei Chi Liu, Kwang Lung Lin

研究成果: Article

11 引文 斯高帕斯(Scopus)

摘要

The interfacial interaction between the Sn-8.55Zn-0.5Ag-0.5Ga-0.1Al solder and three kinds of metallized substrates (Cu, Cu/Au, and Cu/Ni-P/Au) does not form the Cu-Sn intermetallic compound (IMC). Continuous Cu-Zn and discontinuous Ag-Zn interfacial IMC layers formed between the Cu and Sn-Zn-Ag-Ga-Al solder, while Cu-Zn and Au-Al-Zn IMCs formed on the Cu/Au substrate. Only the Au-Al-Zn IMC formed at the interface when the electroless Ni-P deposit was the diffusion barrier between Cu and the Au surface layer.

原文English
頁(從 - 到)7-13
頁數7
期刊Journal of Electronic Materials
33
發行號1
DOIs
出版狀態Published - 2004 一月 2

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering
  • Materials Chemistry

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