The Intermetallic Compound Formation for the Wire Bond Between an Al Pad and Ag-xPd Alloy Wire

Wei Hsiang Huang, Kwang Lung Lin, Yu Wei Lin, Yun Kai Cheng

研究成果: Article同行評審

7 引文 斯高帕斯(Scopus)

摘要

Silver-palladium alloy wire has been shown as an economical and reliable substitute for gold wire in various applications in the electronic packaging industry. The success of wire bonding relies on the formation of an interfacial intermetallic compound (IMC). This study is aimed to investigate the formation behavior of IMCs between an Al pad and Ag-Pd alloy wire with various Pd concentrations of 1.0–6.0% for the as-bonded commercial Ag/Al joint. The interfacial IMCs were investigated with scanning electron microscopy and energy-dispersive x-ray spectroscopy. The IMCs formed are separate (Ag, Pd)2Al and (Ag, Pd)3Al2 for a Ag6Pd wire bond, while (Ag, Pd)2Al and (Ag, Pd)3Al2 are mixed for the other Ag(1–4.5)Pd alloy wire bonds. The thickness of the total IMC layer varies from 0.65 μm for Ag1Pd to 0.91 μm for Ag6Pd, yet a minimum of 0.44 μm exists for Ag3.5Pd. The compound formation behavior was found to correspond with the Ag–Al phase diagram. After pressure cooker tests, a less stable IMC (Ag, Pd)3Al formed at the AgxPd/Al interface.

原文English
頁(從 - 到)6130-6136
頁數7
期刊Journal of Electronic Materials
45
發行號12
DOIs
出版狀態Published - 2016 十二月 1

All Science Journal Classification (ASJC) codes

  • 電子、光磁材料
  • 凝聚態物理學
  • 電氣與電子工程
  • 材料化學

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