The investigation of buckling, deformation and interaction of elastic films for touch panel applications

Chang Hsin Chuang, Kuo Shen Chen, Chun Chic Chen, Ron Can Hong

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)

摘要

Thin ITO-based PET conductive membranes are the major sensing structure in resistive touch panels for network phones or other applications. However, device failures or malfunctions such as early touch and disagreement between force-applied and touched locations have been reported. By examining the surface profiles, it was found that these membranes have considerable initial out of plane deformation. This could be a sign of membrane buckling since the clamped design could causing additional in-plane compression which could triggering the structural buckling. It is important to analyze the buckling behavior of ITO/PET membranes due to initial imperfection, residual stress, or assembly issues, for developing engineering solutions for quality assurance. In this work, both finite element analyses and essential experimental characterizations are performed as the first step toward solving this problem. In conjunction with our previous study [1], this work mainly focuses on the buckling behavior by considering the effect of the compliance of double side glues and the associated post-buckling behavior. In parallel, several experimental investigations have been conducted for characterizing material properties of the adhesion tapes and the panel surface profile for supporting the buckling and post buckling analyses. By both simulation and experimental investigations, the major control factor for causing malfunction of touch panel could be identified and the corresponding engineering solutions would be developed for enhancing the device reliabilities.

原文English
主出版物標題2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference
主出版物子標題Challenges of Change - Shaping the Future, IMPACT 2014 - Proceedings
發行者Institute of Electrical and Electronics Engineers Inc.
頁面105-108
頁數4
ISBN(電子)9781479977277
DOIs
出版狀態Published - 2014 一月 1
事件9th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2014 - Taipei, Taiwan
持續時間: 2014 十月 222014 十月 24

出版系列

名字2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference: Challenges of Change - Shaping the Future, IMPACT 2014 - Proceedings

Other

Other9th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2014
國家Taiwan
城市Taipei
期間14-10-2214-10-24

All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Electrical and Electronic Engineering
  • Control and Systems Engineering

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    Chuang, C. H., Chen, K. S., Chen, C. C., & Hong, R. C. (2014). The investigation of buckling, deformation and interaction of elastic films for touch panel applications. 於 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference: Challenges of Change - Shaping the Future, IMPACT 2014 - Proceedings (頁 105-108). [7048398] (2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference: Challenges of Change - Shaping the Future, IMPACT 2014 - Proceedings). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/IMPACT.2014.7048398