The kinetics of interfacial interaction between eutectic Sn9Zn solder and nickel plating

Yao Ling Kuo, Kwang-Lung Lin

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)

摘要

The interfacial interaction between liquid eutectic Sn9Zn solder and electroplated Ni layer was investigated in the temperatures range of 230 ∼ 290°C. The interaction gives rise to various Ni-Zn intermetallic compounds, Ni 5Zn 21 and NiZn 3, and Ni-Zn solid solution layer. The evolution of these layers is temperature dependent. The thickness of the interfacial reaction layer was measured with respect to reaction temperature and reaction time. The growth behavior of the interfacial layer and the activation energy of the interaction were discussed. The reaction mechanism was found to vary with respect to reaction temperature.

原文English
主出版物標題APM 2011 Proceedings - 2011 International Symposium on Advanced Packaging Materials
頁面193-198
頁數6
DOIs
出版狀態Published - 2011 十二月 1
事件2011 International Symposium on Advanced Packaging Materials, APM 2011 - Xiamen, China
持續時間: 2011 十月 252011 十月 28

出版系列

名字Proceedings - International Symposium on Advanced Packaging Materials
ISSN(列印)1550-5723

Other

Other2011 International Symposium on Advanced Packaging Materials, APM 2011
國家China
城市Xiamen
期間11-10-2511-10-28

    指紋

All Science Journal Classification (ASJC) codes

  • Industrial and Manufacturing Engineering
  • Materials Science(all)

引用此

Kuo, Y. L., & Lin, K-L. (2011). The kinetics of interfacial interaction between eutectic Sn9Zn solder and nickel plating. 於 APM 2011 Proceedings - 2011 International Symposium on Advanced Packaging Materials (頁 193-198). [6105698] (Proceedings - International Symposium on Advanced Packaging Materials). https://doi.org/10.1109/ISAPM.2011.6105698