The mechanism of Al contents (0-0.09 wt%) on the wettability and interfacial intermetallic compounds growth of Zn-25Sn/Cu

Xi Niu, Kwang Lung Lin

研究成果: Conference contribution

指紋

深入研究「The mechanism of Al contents (0-0.09 wt%) on the wettability and interfacial intermetallic compounds growth of Zn-25Sn/Cu」主題。共同形成了獨特的指紋。

Engineering & Materials Science

Chemical Compounds