The microstructures of the Sn-Zn-Al lead-free solders have been investigated using scanning electron microscopy. The Al and Zn contents of the solders initiated wire 0.45%∼4.5% and 8.55%∼85.5%, respectively. The solders were prepared from the Zn-5Al master alloy and Sn. The precipitates formed in these solders were analyzed for their compositions with energy dispersive spectroscopy. The eutectic temperature and the transition temperatures of these solders upon cooling were identified with cooling curves as well as with differential scanning calorimetry.
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