The microstructures of the Sn-Zn-Al solder alloys

Kwang Lung Lin, Li Hsiang Wen, Tzy Pin Liu

研究成果: Article同行評審

75 引文 斯高帕斯(Scopus)

摘要

The microstructures of the Sn-Zn-Al lead-free solders have been investigated using scanning electron microscopy. The Al and Zn contents of the solders initiated wire 0.45%∼4.5% and 8.55%∼85.5%, respectively. The solders were prepared from the Zn-5Al master alloy and Sn. The precipitates formed in these solders were analyzed for their compositions with energy dispersive spectroscopy. The eutectic temperature and the transition temperatures of these solders upon cooling were identified with cooling curves as well as with differential scanning calorimetry.

原文English
頁(從 - 到)97-105
頁數9
期刊Journal of Electronic Materials
27
發行號3
DOIs
出版狀態Published - 1998 三月

All Science Journal Classification (ASJC) codes

  • 電子、光磁材料
  • 凝聚態物理學
  • 電氣與電子工程
  • 材料化學

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