@article{2d4acf0f1ce34c81a9fda35053e67925,
title = "The newly developed Sn–Bi–Zn alloy with a low melting point, improved ductility, and high ultimate tensile strength",
abstract = "A new Sn-45Bi-2.6Zn (wt%) alloy was developed to replace the eutectic Sn-58Bi alloy as a low-melting point solder alloy. A 112% increase in the tensile elongation (0.68 vs. 0.32 in strain) was obtained by increasing the Sn-to-Bi volume ratio by reducing the volume content of brittle Bi. A solidus temperature of 133 °C was calculated from the Sn–Bi–Zn ternary system. The calculation of phase diagram (CALPHAD) method was performed to help understand the melting behavior of Sn-45Bi-2.6Zn alloy.",
author = "Shiqi Zhou and Yang, {Chih han} and Shen, {Yu An} and Lin, {Shih kang} and Hiroshi Nishikawa",
note = "Funding Information: C.H.Y. and S.K.L. wish to thank the financial supports from the Ministry of Science and Technology (MOST), Taiwan (MOST-106-2628-E-006-002-MY3). S.Z, Y.A.S. and H.N. did not receive any specific grant from funding agencies in the public, commercial, or not-for-profit sectors for this research. The authors declare that they have no known competing financial interests or personal relationships that could have appeared to influence the work reported in this paper. The authors declare the following financial interests/personal relationships which may be considered as potential competing interests. Funding Information: C.H.Y. and S.K.L. wish to thank the financial supports from the Ministry of Science and Technology (MOST), Taiwan ( MOST-106-2628-E-006-002-MY3 ). S.Z, Y.A.S., and H.N. did not receive any specific grant from funding agencies in the public, commercial, or not-for-profit sectors for this research. ",
year = "2019",
month = jun,
doi = "10.1016/j.mtla.2019.100300",
language = "English",
volume = "6",
journal = "Materialia",
issn = "2589-1529",
publisher = "Elsevier BV",
}