The Pd distribution and Cu flow pattern of the Pd-plated Cu wire bond and their effect on the nanoindentation

Yu Wei Lin, Ren You Wang, Wun Bin Ke, I. Sheng Wang, Ying Ta Chiu, Kuo Chang Lu, Kwang Lung Lin, Yi Shao Lai

研究成果: Article同行評審

15 引文 斯高帕斯(Scopus)

摘要

The Pd plating on the 20. μm Cu wire dissolves in the free air ball (FAB) and the Cu ball bond during the wire bonding process without forming intermetallic compounds. The limiting supply of Pd and the short bonding process, 15. ms of thermosonic bonding, result in uneven distribution of Pd in the as produced Cu ball bond. Also, the Pd-rich phase may accompany small voids formed within the FAB and the wire bond, and following the direction of semi-solid Cu flow. The Pd distribution, as evidenced by the focused ion beam (FIB) and wavelength dispersive X-ray spectroscopy (WDS) mapping, reveals the whirlpool flow pattern of Cu within the FAB and the ball bond. Pd distributes within the copper ball through convective transport by the copper flow. Additionally, hardness measurements by nanoindentation testing show that the Cu ball bond is harder in the regions where Pd exists.

原文English
頁(從 - 到)152-157
頁數6
期刊Materials Science and Engineering A
543
DOIs
出版狀態Published - 2012 五月 1

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

指紋 深入研究「The Pd distribution and Cu flow pattern of the Pd-plated Cu wire bond and their effect on the nanoindentation」主題。共同形成了獨特的指紋。

引用此