The preferential growth of η-Cu6Sn5 on (111) uni-directional Cu pads

Han Wen Lin, Jia Ling Lu, Chen Min Liu, Chih Chen, King Ning Tu, Delphic Chen, Jui-Chao Kuo

研究成果: Conference contribution

1 引文 (Scopus)

摘要

The uni-directional Cu with surface covered by (111) plane can be made by electroplating. The shape of Cu grain was columnar. The diameters of these columnar grains were 2 - 5 μm. After electroplating SnAg2.3 on the Cu pad and then reflowed at 260 oC, the -Cu6Sn5s have shown a preferential growth relationship on the uni-directional Cu. At the early stage of reflowing, the orientations of Cu6Sn5 were preferred at (0001). As the time of reflow extended, the orientations of Cu 6Sn5 would change to be preferred at (2113). Since the uni-directional Cu was still poly-crystal metal, the coherence must be achieved by Cu-Sn bonding at the interface between Cu pads and the intermetallics. Electroplating parameters would affect the quality of uni-directional Cu and therefore affecting the preferential behavior of Cu6Sn5. With the technique of electroplating (111) uni-directional Cu, it is possible to control the orientations of intermetallics in the solder joints.

原文English
主出版物標題2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2012 - Proceedings
頁面90-93
頁數4
DOIs
出版狀態Published - 2012 十二月 1
事件2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2012 - Taipei, Taiwan
持續時間: 2012 十月 242012 十月 26

出版系列

名字Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT
ISSN(列印)2150-5934
ISSN(電子)2150-5942

Other

Other2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2012
國家Taiwan
城市Taipei
期間12-10-2412-10-26

指紋

Electroplating
Intermetallics
Soldering alloys
Crystals
Metals

All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Control and Systems Engineering
  • Electrical and Electronic Engineering

引用此文

Lin, H. W., Lu, J. L., Liu, C. M., Chen, C., Tu, K. N., Chen, D., & Kuo, J-C. (2012). The preferential growth of η-Cu6Sn5 on (111) uni-directional Cu pads. 於 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2012 - Proceedings (頁 90-93). [6420285] (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT). https://doi.org/10.1109/IMPACT.2012.6420285
Lin, Han Wen ; Lu, Jia Ling ; Liu, Chen Min ; Chen, Chih ; Tu, King Ning ; Chen, Delphic ; Kuo, Jui-Chao. / The preferential growth of η-Cu6Sn5 on (111) uni-directional Cu pads. 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2012 - Proceedings. 2012. 頁 90-93 (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT).
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title = "The preferential growth of η-Cu6Sn5 on (111) uni-directional Cu pads",
abstract = "The uni-directional Cu with surface covered by (111) plane can be made by electroplating. The shape of Cu grain was columnar. The diameters of these columnar grains were 2 - 5 μm. After electroplating SnAg2.3 on the Cu pad and then reflowed at 260 oC, the -Cu6Sn5s have shown a preferential growth relationship on the uni-directional Cu. At the early stage of reflowing, the orientations of Cu6Sn5 were preferred at (0001). As the time of reflow extended, the orientations of Cu 6Sn5 would change to be preferred at (2113). Since the uni-directional Cu was still poly-crystal metal, the coherence must be achieved by Cu-Sn bonding at the interface between Cu pads and the intermetallics. Electroplating parameters would affect the quality of uni-directional Cu and therefore affecting the preferential behavior of Cu6Sn5. With the technique of electroplating (111) uni-directional Cu, it is possible to control the orientations of intermetallics in the solder joints.",
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Lin, HW, Lu, JL, Liu, CM, Chen, C, Tu, KN, Chen, D & Kuo, J-C 2012, The preferential growth of η-Cu6Sn5 on (111) uni-directional Cu pads. 於 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2012 - Proceedings., 6420285, Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT, 頁 90-93, 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2012, Taipei, Taiwan, 12-10-24. https://doi.org/10.1109/IMPACT.2012.6420285

The preferential growth of η-Cu6Sn5 on (111) uni-directional Cu pads. / Lin, Han Wen; Lu, Jia Ling; Liu, Chen Min; Chen, Chih; Tu, King Ning; Chen, Delphic; Kuo, Jui-Chao.

2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2012 - Proceedings. 2012. p. 90-93 6420285 (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT).

研究成果: Conference contribution

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AU - Lin, Han Wen

AU - Lu, Jia Ling

AU - Liu, Chen Min

AU - Chen, Chih

AU - Tu, King Ning

AU - Chen, Delphic

AU - Kuo, Jui-Chao

PY - 2012/12/1

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N2 - The uni-directional Cu with surface covered by (111) plane can be made by electroplating. The shape of Cu grain was columnar. The diameters of these columnar grains were 2 - 5 μm. After electroplating SnAg2.3 on the Cu pad and then reflowed at 260 oC, the -Cu6Sn5s have shown a preferential growth relationship on the uni-directional Cu. At the early stage of reflowing, the orientations of Cu6Sn5 were preferred at (0001). As the time of reflow extended, the orientations of Cu 6Sn5 would change to be preferred at (2113). Since the uni-directional Cu was still poly-crystal metal, the coherence must be achieved by Cu-Sn bonding at the interface between Cu pads and the intermetallics. Electroplating parameters would affect the quality of uni-directional Cu and therefore affecting the preferential behavior of Cu6Sn5. With the technique of electroplating (111) uni-directional Cu, it is possible to control the orientations of intermetallics in the solder joints.

AB - The uni-directional Cu with surface covered by (111) plane can be made by electroplating. The shape of Cu grain was columnar. The diameters of these columnar grains were 2 - 5 μm. After electroplating SnAg2.3 on the Cu pad and then reflowed at 260 oC, the -Cu6Sn5s have shown a preferential growth relationship on the uni-directional Cu. At the early stage of reflowing, the orientations of Cu6Sn5 were preferred at (0001). As the time of reflow extended, the orientations of Cu 6Sn5 would change to be preferred at (2113). Since the uni-directional Cu was still poly-crystal metal, the coherence must be achieved by Cu-Sn bonding at the interface between Cu pads and the intermetallics. Electroplating parameters would affect the quality of uni-directional Cu and therefore affecting the preferential behavior of Cu6Sn5. With the technique of electroplating (111) uni-directional Cu, it is possible to control the orientations of intermetallics in the solder joints.

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Lin HW, Lu JL, Liu CM, Chen C, Tu KN, Chen D 等. The preferential growth of η-Cu6Sn5 on (111) uni-directional Cu pads. 於 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2012 - Proceedings. 2012. p. 90-93. 6420285. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT). https://doi.org/10.1109/IMPACT.2012.6420285