The striated deformation of Sn solders under high frequency resonant vibration

C. M. Chuang, T. S. Lui, L. H. Chen

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)

摘要

A striated deformation feature was found commonly in solders during vibration test. This deformation evidence will be promoted under resonant vibration for the Sn-rich phase with a coarse size or the specimens with a longer vibration cycles. For Sn-Pb solders, the occurrence of striated deformation tend to generate fine intergranular cracks that will promote the crack propagation and the formation of main crack. On the other hand, for lead-free Sn-Zn and Sn-Ag solders, the striated deformation virtually plays an important role in absorbing the vibration energy and leads to an improvement of the vibration fracture resistance.

原文English
主出版物標題Advances in Electronic Materials and Packaging 2001
編輯S.B. Lee, K.W. Paik
發行者Institute of Electrical and Electronics Engineers Inc.
頁面328-334
頁數7
ISBN(電子)0780371577, 9780780371576
DOIs
出版狀態Published - 2001 1月 1
事件3rd International Symposium on Electronic Materials and Packaging, EMAP 2001 - Jeju Island, Korea, Republic of
持續時間: 2001 11月 192001 11月 22

出版系列

名字Advances in Electronic Materials and Packaging 2001

Other

Other3rd International Symposium on Electronic Materials and Packaging, EMAP 2001
國家/地區Korea, Republic of
城市Jeju Island
期間01-11-1901-11-22

All Science Journal Classification (ASJC) codes

  • 電氣與電子工程
  • 電子、光磁材料

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