@inproceedings{794b01e1545b4220941981334942f920,
title = "The striated deformation of Sn solders under high frequency resonant vibration",
abstract = "A striated deformation feature was found commonly in solders during vibration test. This deformation evidence will be promoted under resonant vibration for the Sn-rich phase with a coarse size or the specimens with a longer vibration cycles. For Sn-Pb solders, the occurrence of striated deformation tend to generate fine intergranular cracks that will promote the crack propagation and the formation of main crack. On the other hand, for lead-free Sn-Zn and Sn-Ag solders, the striated deformation virtually plays an important role in absorbing the vibration energy and leads to an improvement of the vibration fracture resistance.",
author = "Chuang, {C. M.} and Lui, {T. S.} and Chen, {L. H.}",
year = "2001",
month = jan,
day = "1",
doi = "10.1109/EMAP.2001.984005",
language = "English",
series = "Advances in Electronic Materials and Packaging 2001",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "328--334",
editor = "S.B. Lee and K.W. Paik",
booktitle = "Advances in Electronic Materials and Packaging 2001",
address = "United States",
note = "3rd International Symposium on Electronic Materials and Packaging, EMAP 2001 ; Conference date: 19-11-2001 Through 22-11-2001",
}