The striated deformation of Sn solders under high frequency resonant vibration

C. M. Chuang; T. S. Lui; L. H. Chen

doi:10.1109/EMAP.2001.984005

The striated deformation of Sn solders under high frequency resonant vibration

C. M. Chuang, T. S. Lui, L. H. Chen

研究成果: Conference contribution

1 引文斯高帕斯（Scopus）

摘要

A striated deformation feature was found commonly in solders during vibration test. This deformation evidence will be promoted under resonant vibration for the Sn-rich phase with a coarse size or the specimens with a longer vibration cycles. For Sn-Pb solders, the occurrence of striated deformation tend to generate fine intergranular cracks that will promote the crack propagation and the formation of main crack. On the other hand, for lead-free Sn-Zn and Sn-Ag solders, the striated deformation virtually plays an important role in absorbing the vibration energy and leads to an improvement of the vibration fracture resistance.

原文	English
主出版物標題	Advances in Electronic Materials and Packaging 2001
編輯	S.B. Lee, K.W. Paik
發行者	Institute of Electrical and Electronics Engineers Inc.
頁面	328-334
頁數	7
ISBN（電子）	0780371577, 9780780371576
DOIs	https://doi.org/10.1109/EMAP.2001.984005
出版狀態	Published - 2001 一月 1
事件	3rd International Symposium on Electronic Materials and Packaging, EMAP 2001 - Jeju Island, Korea, Republic of 持續時間: 2001 十一月 19 → 2001 十一月 22

出版系列

名字	Advances in Electronic Materials and Packaging 2001

Other

Other	3rd International Symposium on Electronic Materials and Packaging, EMAP 2001
國家	Korea, Republic of
城市	Jeju Island
期間	01-11-19 → 01-11-22

指紋

All Science Journal Classification (ASJC) codes

Electrical and Electronic Engineering
Electronic, Optical and Magnetic Materials

引用此

Chuang, C. M., Lui, T. S., & Chen, L. H. (2001). The striated deformation of Sn solders under high frequency resonant vibration. 於 S. B. Lee, & K. W. Paik (編輯), Advances in Electronic Materials and Packaging 2001 (頁 328-334). [984005] (Advances in Electronic Materials and Packaging 2001). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EMAP.2001.984005

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title = "The striated deformation of Sn solders under high frequency resonant vibration",

abstract = "A striated deformation feature was found commonly in solders during vibration test. This deformation evidence will be promoted under resonant vibration for the Sn-rich phase with a coarse size or the specimens with a longer vibration cycles. For Sn-Pb solders, the occurrence of striated deformation tend to generate fine intergranular cracks that will promote the crack propagation and the formation of main crack. On the other hand, for lead-free Sn-Zn and Sn-Ag solders, the striated deformation virtually plays an important role in absorbing the vibration energy and leads to an improvement of the vibration fracture resistance.",

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Chuang, CM, Lui, TS & Chen, LH 2001, The striated deformation of Sn solders under high frequency resonant vibration. 於 SB Lee & KW Paik (編輯), Advances in Electronic Materials and Packaging 2001., 984005, Advances in Electronic Materials and Packaging 2001, Institute of Electrical and Electronics Engineers Inc., 頁 328-334, 3rd International Symposium on Electronic Materials and Packaging, EMAP 2001, Jeju Island, Korea, Republic of, 01-11-19. https://doi.org/10.1109/EMAP.2001.984005

The striated deformation of Sn solders under high frequency resonant vibration. / Chuang, C. M.; Lui, T. S.; Chen, L. H.

Advances in Electronic Materials and Packaging 2001. 編輯 / S.B. Lee; K.W. Paik. Institute of Electrical and Electronics Engineers Inc., 2001. p. 328-334 984005 (Advances in Electronic Materials and Packaging 2001).

研究成果: Conference contribution

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N2 - A striated deformation feature was found commonly in solders during vibration test. This deformation evidence will be promoted under resonant vibration for the Sn-rich phase with a coarse size or the specimens with a longer vibration cycles. For Sn-Pb solders, the occurrence of striated deformation tend to generate fine intergranular cracks that will promote the crack propagation and the formation of main crack. On the other hand, for lead-free Sn-Zn and Sn-Ag solders, the striated deformation virtually plays an important role in absorbing the vibration energy and leads to an improvement of the vibration fracture resistance.

AB - A striated deformation feature was found commonly in solders during vibration test. This deformation evidence will be promoted under resonant vibration for the Sn-rich phase with a coarse size or the specimens with a longer vibration cycles. For Sn-Pb solders, the occurrence of striated deformation tend to generate fine intergranular cracks that will promote the crack propagation and the formation of main crack. On the other hand, for lead-free Sn-Zn and Sn-Ag solders, the striated deformation virtually plays an important role in absorbing the vibration energy and leads to an improvement of the vibration fracture resistance.

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存取文件

10.1109/EMAP.2001.984005