Copper wetting times were measured for various Al-Zn-Sn solders using a wetting balance. Wettability of Cu with the Al-Zn-Sn solders was enhanced by increasing the Al and Zn contents. A scanning electron microscope (SEM) investigation on the solidified wetting sample revealed that diffusion of Al and Zn towards Cu is responsible for the observed wetting behaviour. The dipping speed is also important.
|頁（從 - 到）||5-8|
|期刊||Journal of Materials Science: Materials in Electronics|
|出版狀態||Published - 1998|
All Science Journal Classification (ASJC) codes