The wetting of copper by Al-Zn-Sn solders

Kwang Lung Lin, Li Hsiang Wen

研究成果: Article同行評審

35 引文 斯高帕斯(Scopus)

摘要

Copper wetting times were measured for various Al-Zn-Sn solders using a wetting balance. Wettability of Cu with the Al-Zn-Sn solders was enhanced by increasing the Al and Zn contents. A scanning electron microscope (SEM) investigation on the solidified wetting sample revealed that diffusion of Al and Zn towards Cu is responsible for the observed wetting behaviour. The dipping speed is also important.

原文English
頁(從 - 到)5-8
頁數4
期刊Journal of Materials Science: Materials in Electronics
9
發行號1
DOIs
出版狀態Published - 1998

All Science Journal Classification (ASJC) codes

  • 電子、光磁材料
  • 原子與分子物理與光學
  • 凝聚態物理學
  • 電氣與電子工程

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