Thermal analysis of a laser peeling technique for removing micro edge cracks of ultrathin glass substrates for web processing

Tian Shiang Yang, Guang Di Chen, Kuo Shen Chen, Rong Can Hong, Tz Cheng Chiu, Chang Da Wen, Chun Han Li, Chien Jung Huang, Kun Tso Chen, Mao Chi Lin

研究成果: Conference contribution

3 引文 (Scopus)

摘要

Ultrathin glass is a promising substrate material for web processing (also called roll-to-roll processing) of flexible electronics, but is highly susceptible to breaking and cracking due to the almost inevitable presence of substrate-edge defects. Recently, a novel technique for removing the micro cracks on the edges of ultrathin glass substrates was devised at ITRI. It amounts to shining a CO2 laser on one edge of a substrate, which induces spontaneous peeling of a thin layer containing preexisting cracks on the edge from the substrate, resulting in an essentially crack-free new substrate edge. Exploiting the thinness of ultrathin glass substrates, here we propose a simplified two-dimensional thermal model for the laser peeling process, and obtain an analytic expression for the transient temperature variation in a substrate being peeled. This enables us to locate the "thermally affected zone" in the substrate, which turns out to be impressively similar in size and shape to the substrate-edge peels observed in experiments. Moreover, a quantitative criterion for the minimum cooling rate required for the progression of the peeling process is obtained. The results here thus provide useful insights into the laser peeling mechanism, and can be used to expedite the optimization of process parameters. Some preliminary purely numerical results using a finite element method (FEM) based software also are briefly discussed here.

原文English
主出版物標題Micro- and Nano-Systems Engineering and Packaging
發行者American Society of Mechanical Engineers (ASME)
ISBN(電子)9780791857533
DOIs
出版狀態Published - 2015 一月 1
事件ASME 2015 International Mechanical Engineering Congress and Exposition, IMECE 2015 - Houston, United States
持續時間: 2015 十一月 132015 十一月 19

出版系列

名字ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)
10-2015

Other

OtherASME 2015 International Mechanical Engineering Congress and Exposition, IMECE 2015
國家United States
城市Houston
期間15-11-1315-11-19

指紋

Peeling
Thermoanalysis
Cracks
Glass
Lasers
Substrates
Processing
Flexible electronics
Cooling
Finite element method
Defects

All Science Journal Classification (ASJC) codes

  • Mechanical Engineering

引用此文

Yang, T. S., Chen, G. D., Chen, K. S., Hong, R. C., Chiu, T. C., Wen, C. D., ... Lin, M. C. (2015). Thermal analysis of a laser peeling technique for removing micro edge cracks of ultrathin glass substrates for web processing. 於 Micro- and Nano-Systems Engineering and Packaging (ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE); 卷 10-2015). American Society of Mechanical Engineers (ASME). https://doi.org/10.1115/IMECE2015-50316
Yang, Tian Shiang ; Chen, Guang Di ; Chen, Kuo Shen ; Hong, Rong Can ; Chiu, Tz Cheng ; Wen, Chang Da ; Li, Chun Han ; Huang, Chien Jung ; Chen, Kun Tso ; Lin, Mao Chi. / Thermal analysis of a laser peeling technique for removing micro edge cracks of ultrathin glass substrates for web processing. Micro- and Nano-Systems Engineering and Packaging. American Society of Mechanical Engineers (ASME), 2015. (ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)).
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abstract = "Ultrathin glass is a promising substrate material for web processing (also called roll-to-roll processing) of flexible electronics, but is highly susceptible to breaking and cracking due to the almost inevitable presence of substrate-edge defects. Recently, a novel technique for removing the micro cracks on the edges of ultrathin glass substrates was devised at ITRI. It amounts to shining a CO2 laser on one edge of a substrate, which induces spontaneous peeling of a thin layer containing preexisting cracks on the edge from the substrate, resulting in an essentially crack-free new substrate edge. Exploiting the thinness of ultrathin glass substrates, here we propose a simplified two-dimensional thermal model for the laser peeling process, and obtain an analytic expression for the transient temperature variation in a substrate being peeled. This enables us to locate the {"}thermally affected zone{"} in the substrate, which turns out to be impressively similar in size and shape to the substrate-edge peels observed in experiments. Moreover, a quantitative criterion for the minimum cooling rate required for the progression of the peeling process is obtained. The results here thus provide useful insights into the laser peeling mechanism, and can be used to expedite the optimization of process parameters. Some preliminary purely numerical results using a finite element method (FEM) based software also are briefly discussed here.",
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Yang, TS, Chen, GD, Chen, KS, Hong, RC, Chiu, TC, Wen, CD, Li, CH, Huang, CJ, Chen, KT & Lin, MC 2015, Thermal analysis of a laser peeling technique for removing micro edge cracks of ultrathin glass substrates for web processing. 於 Micro- and Nano-Systems Engineering and Packaging. ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE), 卷 10-2015, American Society of Mechanical Engineers (ASME), ASME 2015 International Mechanical Engineering Congress and Exposition, IMECE 2015, Houston, United States, 15-11-13. https://doi.org/10.1115/IMECE2015-50316

Thermal analysis of a laser peeling technique for removing micro edge cracks of ultrathin glass substrates for web processing. / Yang, Tian Shiang; Chen, Guang Di; Chen, Kuo Shen; Hong, Rong Can; Chiu, Tz Cheng; Wen, Chang Da; Li, Chun Han; Huang, Chien Jung; Chen, Kun Tso; Lin, Mao Chi.

Micro- and Nano-Systems Engineering and Packaging. American Society of Mechanical Engineers (ASME), 2015. (ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE); 卷 10-2015).

研究成果: Conference contribution

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T1 - Thermal analysis of a laser peeling technique for removing micro edge cracks of ultrathin glass substrates for web processing

AU - Yang, Tian Shiang

AU - Chen, Guang Di

AU - Chen, Kuo Shen

AU - Hong, Rong Can

AU - Chiu, Tz Cheng

AU - Wen, Chang Da

AU - Li, Chun Han

AU - Huang, Chien Jung

AU - Chen, Kun Tso

AU - Lin, Mao Chi

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N2 - Ultrathin glass is a promising substrate material for web processing (also called roll-to-roll processing) of flexible electronics, but is highly susceptible to breaking and cracking due to the almost inevitable presence of substrate-edge defects. Recently, a novel technique for removing the micro cracks on the edges of ultrathin glass substrates was devised at ITRI. It amounts to shining a CO2 laser on one edge of a substrate, which induces spontaneous peeling of a thin layer containing preexisting cracks on the edge from the substrate, resulting in an essentially crack-free new substrate edge. Exploiting the thinness of ultrathin glass substrates, here we propose a simplified two-dimensional thermal model for the laser peeling process, and obtain an analytic expression for the transient temperature variation in a substrate being peeled. This enables us to locate the "thermally affected zone" in the substrate, which turns out to be impressively similar in size and shape to the substrate-edge peels observed in experiments. Moreover, a quantitative criterion for the minimum cooling rate required for the progression of the peeling process is obtained. The results here thus provide useful insights into the laser peeling mechanism, and can be used to expedite the optimization of process parameters. Some preliminary purely numerical results using a finite element method (FEM) based software also are briefly discussed here.

AB - Ultrathin glass is a promising substrate material for web processing (also called roll-to-roll processing) of flexible electronics, but is highly susceptible to breaking and cracking due to the almost inevitable presence of substrate-edge defects. Recently, a novel technique for removing the micro cracks on the edges of ultrathin glass substrates was devised at ITRI. It amounts to shining a CO2 laser on one edge of a substrate, which induces spontaneous peeling of a thin layer containing preexisting cracks on the edge from the substrate, resulting in an essentially crack-free new substrate edge. Exploiting the thinness of ultrathin glass substrates, here we propose a simplified two-dimensional thermal model for the laser peeling process, and obtain an analytic expression for the transient temperature variation in a substrate being peeled. This enables us to locate the "thermally affected zone" in the substrate, which turns out to be impressively similar in size and shape to the substrate-edge peels observed in experiments. Moreover, a quantitative criterion for the minimum cooling rate required for the progression of the peeling process is obtained. The results here thus provide useful insights into the laser peeling mechanism, and can be used to expedite the optimization of process parameters. Some preliminary purely numerical results using a finite element method (FEM) based software also are briefly discussed here.

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Yang TS, Chen GD, Chen KS, Hong RC, Chiu TC, Wen CD 等. Thermal analysis of a laser peeling technique for removing micro edge cracks of ultrathin glass substrates for web processing. 於 Micro- and Nano-Systems Engineering and Packaging. American Society of Mechanical Engineers (ASME). 2015. (ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)). https://doi.org/10.1115/IMECE2015-50316