Thermal characteristics and thermomechanical reliability of board-level stacked-die packages subjected to coupled power and thermal cycling test

Tong Hong Wang, Chang Chi Lee, Yi Shao Lai, Yu Cheng Lin

研究成果: Article同行評審

4 引文 斯高帕斯(Scopus)

摘要

The sequential thermal-mechanical coupling analysis, which solves in turn the transient temperature field and subsequent thermomechanical deformations, is performed to investigate thermal characteristics along with fatigue reliability of a board-level stacked-die package under coupled power and thermal cycling test conditions. Different powering conditions and sequences are compared. From the numerical results, we note that under coupled power and thermal cycling tests, reliability performances of a board-level stacked-die package should be similar as long as the total power dissipation prescribed to the package is identical, regardless of how the power distributes among separate dies.

原文English
頁(從 - 到)495-502
頁數8
期刊IEEE Transactions on Components and Packaging Technologies
31
發行號2 SPEC. ISS.
DOIs
出版狀態Published - 2008 十二月 1

All Science Journal Classification (ASJC) codes

  • 電子、光磁材料
  • 電氣與電子工程

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