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Thermal conduction of a circular inclusion with variable interface parameter
Tungyang Chen
土木工程學系
研究成果
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同行評審
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引文 斯高帕斯(Scopus)
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深入研究「Thermal conduction of a circular inclusion with variable interface parameter」主題。共同形成了獨特的指紋。
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Mathematics
Conduction
100%
Effective Conductivity
81%
Composite
70%
Imperfect Interface
65%
Inclusion
64%
Unknown
26%
Tensor
21%
Effective Properties
18%
Trigonometric Series
16%
Infinite Matrices
15%
Microstructure
15%
Imperfect
15%
Fourier coefficients
13%
Orthogonality
13%
Algebraic Equation
12%
Vary
11%
Boundary Value Problem
9%
Estimate
6%
Physics & Astronomy
inclusions
63%
conduction
53%
composite materials
42%
conductivity
30%
tensors
17%
orthogonality
13%
boundary value problems
11%
microstructure
6%
estimates
6%
matrices
6%
coefficients
6%
Engineering & Materials Science
Composite materials
46%
Hot Temperature
38%
Dispersions
35%
Tensors
26%
Boundary value problems
14%
Microstructure
9%
Chemical Compounds
Composite Material
40%
Conductivity
35%
Microstructure
9%