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Thermal conduction of a circular inclusion with variable interface parameter
Tungyang Chen
土木工程學系
研究成果
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同行評審
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引文 斯高帕斯(Scopus)
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深入研究「Thermal conduction of a circular inclusion with variable interface parameter」主題。共同形成了獨特的指紋。
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Mathematics
Algebraic Equation
12%
Boundary Value Problem
9%
Composite
70%
Conduction
100%
Effective Conductivity
81%
Effective Properties
18%
Estimate
6%
Fourier coefficients
13%
Imperfect
15%
Imperfect Interface
65%
Inclusion
64%
Infinite Matrices
15%
Microstructure
15%
Orthogonality
13%
Tensor
21%
Trigonometric Series
16%
Unknown
26%
Vary
11%
Physics & Astronomy
boundary value problems
11%
coefficients
6%
composite materials
42%
conduction
53%
conductivity
30%
estimates
6%
inclusions
63%
matrices
6%
microstructure
6%
orthogonality
13%
tensors
17%
Engineering & Materials Science
Boundary value problems
14%
Composite materials
46%
Dispersions
35%
Hot Temperature
38%
Microstructure
9%
Tensors
26%
Chemical Compounds
Composite Material
40%
Conductivity
35%
Microstructure
9%