Thermal dissipation of high-brightness light emitting diode by using multiwalled carbon nanotube/SiC composites

Bing Jing Li, Chih Hsiang Chang, Yun Kuin Su, Kwang Jow Gan

研究成果: Article同行評審

2 引文 斯高帕斯(Scopus)

摘要

To improve the thermal conductance of epoxy used in the high-brightness light emitting diode (HB-LED) package, varied types of fillers were investigated. These fillers included non-functionalized multiwalled carbon nanotubes (MWCNTs), functionalized MWCNTs, micro-SiC particles and the composite of functionalized MWCNTs and micro-SiC particles. Forward voltages at test conditions, junction temperatures, luminous fluxes and operation current-forward voltage (I-V) relation of HB-LEDs were measured or determined for varied combination and contents of fillers in the epoxy. The experimental results showed the epoxy with the composite of 30wt% of SiC and 5wt% of MWCNTs had the best thermal properties. Comparing to commercial epoxy, under the operation of injection current of 350 mA, the MWCNT/SiC/epoxy could decrease junction temperature from 123 to 93 °C and thermal resistance from 81 to 65°C/W.

原文English
文章編號06GE09
期刊Japanese journal of applied physics
50
發行號6 PART 2
DOIs
出版狀態Published - 2011 六月 1

All Science Journal Classification (ASJC) codes

  • Engineering(all)
  • Physics and Astronomy(all)

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