Thermal performance analysis for packaging configuration design of multifinger GaInP collector-up HBTs as small high-power amplifiers

H. C. Tseng, P. H. Lee, Jung-Hua Chou

研究成果: Conference contribution

3 引文 斯高帕斯(Scopus)

摘要

A finite-element modeling (FEM) methodology is utilized to investigate the thermal performance of GaInP collector-up heterojunction bipolar transistors (C-up HBTs) with thermal-via packaging configurations. The thermal interaction between HBT fingers has been examined based on the temperature distribution phenomena in multifinger C-up HBTs. The results obtained from the C-up HBT with a three-finger structure indicate that the thickness of thermal-via configuration can be further reduced by 33% without deteriorating the thermal performance. From this analysis, it is demonstrated that thinning the thermal-via packaging design should be an effective approach for miniaturization of C-up HBTs as high-power amplifiers in cellular-phone communication systems.

原文English
主出版物標題Proceedings of the 2007 8th International Conference on Electronic Packaging Technology, ICEPT
DOIs
出版狀態Published - 2007 十二月 1
事件2007 8th International Conference on Electronic Packaging Technology, ICEPT - Shanghai, China
持續時間: 2007 八月 142007 八月 17

出版系列

名字Proceedings of the Electronic Packaging Technology Conference, EPTC

Other

Other2007 8th International Conference on Electronic Packaging Technology, ICEPT
國家/地區China
城市Shanghai
期間07-08-1407-08-17

All Science Journal Classification (ASJC) codes

  • 工程 (全部)

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