Thermal Performance of Pump-assisted Loop Heat Pipe using R245fa as Working Fluid

Shyy Woei Chang, Kuei Feng Chiang, Fang Chou Lin, Wei Sheng Hung

研究成果: Conference contribution

摘要

The thermal performances of two loop heat pipes driven by capillary force (CF) and pumping force (PF) using R245a as working fluid were experimentally studied. The variations responsive to the adjustments of heating power, condenser cooling condition and flow rate of working fluid for the average Nusselt numbers of evaporator and condenser, the heat transmission networks, the total thermal resistances and the cooling power consumptions for the CF and PF loop heat pipes were comparatively examined. A selective set of experimental data demonstrated the improvements of thermal performance for the PF loop heat pipe due to the increased vapor-liquid circulation rates and the modified pressure drop characteristics along the loop. The dominant physics for the thermal performance improvements from the CF references were discussed. A set of empirical correlations that permitted the evaluation of the total thermal resistances of the PF loop were devised to assist the relevant engineering applications. Justified by the vanished start-up limit and the reductions of thermal resistance disclosed by the present preliminary study, the research focuses for the technology advancement of the forced convective loop heat pipe was recommended.

原文English
主出版物標題Proceedings of the 19th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2020
發行者IEEE Computer Society
頁面113-123
頁數11
ISBN(電子)9781728197647
DOIs
出版狀態Published - 2020 七月
事件19th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2020 - Virtual, Orlando, United States
持續時間: 2020 七月 212020 七月 23

出版系列

名字InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM
2020-July
ISSN(列印)1936-3958

Conference

Conference19th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2020
國家/地區United States
城市Virtual, Orlando
期間20-07-2120-07-23

All Science Journal Classification (ASJC) codes

  • 控制與系統工程
  • 電氣與電子工程

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