Thermal resistance of side by side multi-chip package: Thermal mode analysis

Dao Long Chen, Tei Chen Chen, Ping Feng Yang, Yi Shao Lai

研究成果: Article同行評審

9 引文 斯高帕斯(Scopus)

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深入研究「Thermal resistance of side by side multi-chip package: Thermal mode analysis」主題。共同形成了獨特的指紋。

Chemical Compounds

Physics & Astronomy

Engineering & Materials Science