Thermal study of enhanced plastic ball grid array package with flat heat spreader

T. P. Huang, Gien-Huang Wu

研究成果: Article同行評審

1 引文 斯高帕斯(Scopus)

指紋 深入研究「Thermal study of enhanced plastic ball grid array package with flat heat spreader」主題。共同形成了獨特的指紋。

Chemical Compounds

Engineering & Materials Science