Thermo-mechanical analysis of laser peeling of ultrathin glass for removing edge flaws in web processing applications

Kuo Shen Chen, Tian Shiang Yang, Ron Can Hong, Tz Cheng Chiu, Alex C.D. Wen, Chun Han Li, Chien Jung Huang, Kun Tso Chen, Mao Chi Lin

研究成果: Conference contribution

1 引文 (Scopus)

摘要

Laser peeling is an efficient method for removing edge defects on ultra-thin glass for enabling the subsequent roll-to-roll glass processing for display applications. This process involves complicated interaction in various fields such as heat transfer, stress, fracture, and material properties variations. In order to guide the process design for optimizing the laser peeling process, it is important to conduct necessary analyses. In this work, the laser peeling process is modelled as a moving heat source and the corresponding heat transfer, thermal stress, and crack propagation are then simulated. Problems observed during experiments are firstly explained based on simulation results. Finally, essential parametric studied are also performed for providing recommendation for process optimization.

原文English
主出版物標題Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2016
編輯Yoshio Mita, Marta Rencz, Benoit Charlot, Peter Schneider, Niels Tas, Pascal Nouet, Francis Pressecq
發行者Institute of Electrical and Electronics Engineers Inc.
ISBN(電子)9781509014576
DOIs
出版狀態Published - 2016 七月 15
事件18th Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2016 - Budapest, Hungary
持續時間: 2016 五月 302016 六月 2

出版系列

名字Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2016

Other

Other18th Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2016
國家Hungary
城市Budapest
期間16-05-3016-06-02

指紋

Peeling
Glass
Defects
Lasers
Processing
Heat transfer
Thermal stress
Crack propagation
Process design
Materials properties
Display devices
Experiments

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering
  • Mechanical Engineering

引用此文

Chen, K. S., Yang, T. S., Hong, R. C., Chiu, T. C., Wen, A. C. D., Li, C. H., ... Lin, M. C. (2016). Thermo-mechanical analysis of laser peeling of ultrathin glass for removing edge flaws in web processing applications. 於 Y. Mita, M. Rencz, B. Charlot, P. Schneider, N. Tas, P. Nouet, & F. Pressecq (編輯), Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2016 [7514879] (Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2016). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/DTIP.2016.7514879
Chen, Kuo Shen ; Yang, Tian Shiang ; Hong, Ron Can ; Chiu, Tz Cheng ; Wen, Alex C.D. ; Li, Chun Han ; Huang, Chien Jung ; Chen, Kun Tso ; Lin, Mao Chi. / Thermo-mechanical analysis of laser peeling of ultrathin glass for removing edge flaws in web processing applications. Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2016. 編輯 / Yoshio Mita ; Marta Rencz ; Benoit Charlot ; Peter Schneider ; Niels Tas ; Pascal Nouet ; Francis Pressecq. Institute of Electrical and Electronics Engineers Inc., 2016. (Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2016).
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title = "Thermo-mechanical analysis of laser peeling of ultrathin glass for removing edge flaws in web processing applications",
abstract = "Laser peeling is an efficient method for removing edge defects on ultra-thin glass for enabling the subsequent roll-to-roll glass processing for display applications. This process involves complicated interaction in various fields such as heat transfer, stress, fracture, and material properties variations. In order to guide the process design for optimizing the laser peeling process, it is important to conduct necessary analyses. In this work, the laser peeling process is modelled as a moving heat source and the corresponding heat transfer, thermal stress, and crack propagation are then simulated. Problems observed during experiments are firstly explained based on simulation results. Finally, essential parametric studied are also performed for providing recommendation for process optimization.",
author = "Chen, {Kuo Shen} and Yang, {Tian Shiang} and Hong, {Ron Can} and Chiu, {Tz Cheng} and Wen, {Alex C.D.} and Li, {Chun Han} and Huang, {Chien Jung} and Chen, {Kun Tso} and Lin, {Mao Chi}",
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Chen, KS, Yang, TS, Hong, RC, Chiu, TC, Wen, ACD, Li, CH, Huang, CJ, Chen, KT & Lin, MC 2016, Thermo-mechanical analysis of laser peeling of ultrathin glass for removing edge flaws in web processing applications. 於 Y Mita, M Rencz, B Charlot, P Schneider, N Tas, P Nouet & F Pressecq (編輯), Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2016., 7514879, Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2016, Institute of Electrical and Electronics Engineers Inc., 18th Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2016, Budapest, Hungary, 16-05-30. https://doi.org/10.1109/DTIP.2016.7514879

Thermo-mechanical analysis of laser peeling of ultrathin glass for removing edge flaws in web processing applications. / Chen, Kuo Shen; Yang, Tian Shiang; Hong, Ron Can; Chiu, Tz Cheng; Wen, Alex C.D.; Li, Chun Han; Huang, Chien Jung; Chen, Kun Tso; Lin, Mao Chi.

Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2016. 編輯 / Yoshio Mita; Marta Rencz; Benoit Charlot; Peter Schneider; Niels Tas; Pascal Nouet; Francis Pressecq. Institute of Electrical and Electronics Engineers Inc., 2016. 7514879 (Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2016).

研究成果: Conference contribution

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T1 - Thermo-mechanical analysis of laser peeling of ultrathin glass for removing edge flaws in web processing applications

AU - Chen, Kuo Shen

AU - Yang, Tian Shiang

AU - Hong, Ron Can

AU - Chiu, Tz Cheng

AU - Wen, Alex C.D.

AU - Li, Chun Han

AU - Huang, Chien Jung

AU - Chen, Kun Tso

AU - Lin, Mao Chi

PY - 2016/7/15

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N2 - Laser peeling is an efficient method for removing edge defects on ultra-thin glass for enabling the subsequent roll-to-roll glass processing for display applications. This process involves complicated interaction in various fields such as heat transfer, stress, fracture, and material properties variations. In order to guide the process design for optimizing the laser peeling process, it is important to conduct necessary analyses. In this work, the laser peeling process is modelled as a moving heat source and the corresponding heat transfer, thermal stress, and crack propagation are then simulated. Problems observed during experiments are firstly explained based on simulation results. Finally, essential parametric studied are also performed for providing recommendation for process optimization.

AB - Laser peeling is an efficient method for removing edge defects on ultra-thin glass for enabling the subsequent roll-to-roll glass processing for display applications. This process involves complicated interaction in various fields such as heat transfer, stress, fracture, and material properties variations. In order to guide the process design for optimizing the laser peeling process, it is important to conduct necessary analyses. In this work, the laser peeling process is modelled as a moving heat source and the corresponding heat transfer, thermal stress, and crack propagation are then simulated. Problems observed during experiments are firstly explained based on simulation results. Finally, essential parametric studied are also performed for providing recommendation for process optimization.

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BT - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2016

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A2 - Rencz, Marta

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PB - Institute of Electrical and Electronics Engineers Inc.

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Chen KS, Yang TS, Hong RC, Chiu TC, Wen ACD, Li CH 等. Thermo-mechanical analysis of laser peeling of ultrathin glass for removing edge flaws in web processing applications. 於 Mita Y, Rencz M, Charlot B, Schneider P, Tas N, Nouet P, Pressecq F, 編輯, Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2016. Institute of Electrical and Electronics Engineers Inc. 2016. 7514879. (Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2016). https://doi.org/10.1109/DTIP.2016.7514879