Thermo-mechanical analysis of laser peeling of ultrathin glass for removing edge flaws in web processing applications

Kuo Shen Chen, Tian Shiang Yang, Ron Can Hong, Tz Cheng Chiu, Alex C.D. Wen, Chun Han Li, Chien Jung Huang, Kun Tso Chen, Mao Chi Lin

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)

摘要

Laser peeling is an efficient method for removing edge defects on ultra-thin glass for enabling the subsequent roll-to-roll glass processing for display applications. This process involves complicated interaction in various fields such as heat transfer, stress, fracture, and material properties variations. In order to guide the process design for optimizing the laser peeling process, it is important to conduct necessary analyses. In this work, the laser peeling process is modelled as a moving heat source and the corresponding heat transfer, thermal stress, and crack propagation are then simulated. Problems observed during experiments are firstly explained based on simulation results. Finally, essential parametric studied are also performed for providing recommendation for process optimization.

原文English
主出版物標題Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2016
編輯Yoshio Mita, Marta Rencz, Benoit Charlot, Peter Schneider, Niels Tas, Pascal Nouet, Francis Pressecq
發行者Institute of Electrical and Electronics Engineers Inc.
ISBN(電子)9781509014576
DOIs
出版狀態Published - 2016 七月 15
事件18th Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2016 - Budapest, Hungary
持續時間: 2016 五月 302016 六月 2

出版系列

名字Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2016

Other

Other18th Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2016
國家Hungary
城市Budapest
期間16-05-3016-06-02

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering
  • Mechanical Engineering

指紋 深入研究「Thermo-mechanical analysis of laser peeling of ultrathin glass for removing edge flaws in web processing applications」主題。共同形成了獨特的指紋。

引用此