Thermo-mechanical process emulation and sensitivity analysis of wafer warpage after reconstitution in fan-out packaging

研究成果: Conference contribution

摘要

Wafer reconstitution fan-out is a vital process for serving as a buffer to decouple the processing developments between IC fabrication and electronics packaging. By this approach, the IC packaging is then independent from the chip processing. However, such a process brings numerous mechanical loadings during molding and curing phases. In this work, it is desired to examine the key factor of reconstituted wafer warpage by performing solid thermo-mechanical analyses. To have a deeper insight, simplified 2D and detailed 3D finite element analyses have been constructed to mimic the entire Recon process. Detail thermo-mechanical processing steps are then emulated by these finite element models. After model validation, systematic parametric studies are then performed to investigate the controlling factors for dominating the wafer warpage. The simulation results indicated that the thermal expansion coefficients and the Young's modulus of molding compounds could be the dominated factor. By choosing compounds with more desirable above-mentioned mechanical properties, it is expected that a 20 to 30 percentage reduction of warpage can be achieved.

原文English
主出版物標題2019 International Conference on Electronics Packaging, ICEP 2019
發行者Institute of Electrical and Electronics Engineers Inc.
頁面355-360
頁數6
ISBN(電子)9784990218867
DOIs
出版狀態Published - 2019 四月 1
事件2019 International Conference on Electronics Packaging, ICEP 2019 - Niigata, Japan
持續時間: 2019 四月 172019 四月 20

出版系列

名字2019 International Conference on Electronics Packaging, ICEP 2019

Conference

Conference2019 International Conference on Electronics Packaging, ICEP 2019
國家Japan
城市Niigata
期間19-04-1719-04-20

指紋

Fans
Sensitivity analysis
Packaging
Processing
Sheet molding compounds
Electronics packaging
Molding
Thermal expansion
Curing
Buffers
Elastic moduli
Fabrication
Mechanical properties

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Metals and Alloys

引用此文

Yang, C. Y., Chen, K-S., Yang, T-S., Chiu, T-C., & Ho, C-J. (2019). Thermo-mechanical process emulation and sensitivity analysis of wafer warpage after reconstitution in fan-out packaging. 於 2019 International Conference on Electronics Packaging, ICEP 2019 (頁 355-360). [8733604] (2019 International Conference on Electronics Packaging, ICEP 2019). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.23919/ICEP.2019.8733604
Yang, Cheng Ying ; Chen, Kuo-Shen ; Yang, Tian-Shiang ; Chiu, Tz-Cheng ; Ho, Ching-Jenq. / Thermo-mechanical process emulation and sensitivity analysis of wafer warpage after reconstitution in fan-out packaging. 2019 International Conference on Electronics Packaging, ICEP 2019. Institute of Electrical and Electronics Engineers Inc., 2019. 頁 355-360 (2019 International Conference on Electronics Packaging, ICEP 2019).
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abstract = "Wafer reconstitution fan-out is a vital process for serving as a buffer to decouple the processing developments between IC fabrication and electronics packaging. By this approach, the IC packaging is then independent from the chip processing. However, such a process brings numerous mechanical loadings during molding and curing phases. In this work, it is desired to examine the key factor of reconstituted wafer warpage by performing solid thermo-mechanical analyses. To have a deeper insight, simplified 2D and detailed 3D finite element analyses have been constructed to mimic the entire Recon process. Detail thermo-mechanical processing steps are then emulated by these finite element models. After model validation, systematic parametric studies are then performed to investigate the controlling factors for dominating the wafer warpage. The simulation results indicated that the thermal expansion coefficients and the Young's modulus of molding compounds could be the dominated factor. By choosing compounds with more desirable above-mentioned mechanical properties, it is expected that a 20 to 30 percentage reduction of warpage can be achieved.",
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Yang, CY, Chen, K-S, Yang, T-S, Chiu, T-C & Ho, C-J 2019, Thermo-mechanical process emulation and sensitivity analysis of wafer warpage after reconstitution in fan-out packaging. 於 2019 International Conference on Electronics Packaging, ICEP 2019., 8733604, 2019 International Conference on Electronics Packaging, ICEP 2019, Institute of Electrical and Electronics Engineers Inc., 頁 355-360, 2019 International Conference on Electronics Packaging, ICEP 2019, Niigata, Japan, 19-04-17. https://doi.org/10.23919/ICEP.2019.8733604

Thermo-mechanical process emulation and sensitivity analysis of wafer warpage after reconstitution in fan-out packaging. / Yang, Cheng Ying; Chen, Kuo-Shen; Yang, Tian-Shiang; Chiu, Tz-Cheng; Ho, Ching-Jenq.

2019 International Conference on Electronics Packaging, ICEP 2019. Institute of Electrical and Electronics Engineers Inc., 2019. p. 355-360 8733604 (2019 International Conference on Electronics Packaging, ICEP 2019).

研究成果: Conference contribution

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AB - Wafer reconstitution fan-out is a vital process for serving as a buffer to decouple the processing developments between IC fabrication and electronics packaging. By this approach, the IC packaging is then independent from the chip processing. However, such a process brings numerous mechanical loadings during molding and curing phases. In this work, it is desired to examine the key factor of reconstituted wafer warpage by performing solid thermo-mechanical analyses. To have a deeper insight, simplified 2D and detailed 3D finite element analyses have been constructed to mimic the entire Recon process. Detail thermo-mechanical processing steps are then emulated by these finite element models. After model validation, systematic parametric studies are then performed to investigate the controlling factors for dominating the wafer warpage. The simulation results indicated that the thermal expansion coefficients and the Young's modulus of molding compounds could be the dominated factor. By choosing compounds with more desirable above-mentioned mechanical properties, it is expected that a 20 to 30 percentage reduction of warpage can be achieved.

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Yang CY, Chen K-S, Yang T-S, Chiu T-C, Ho C-J. Thermo-mechanical process emulation and sensitivity analysis of wafer warpage after reconstitution in fan-out packaging. 於 2019 International Conference on Electronics Packaging, ICEP 2019. Institute of Electrical and Electronics Engineers Inc. 2019. p. 355-360. 8733604. (2019 International Conference on Electronics Packaging, ICEP 2019). https://doi.org/10.23919/ICEP.2019.8733604