Thermo-mechanical process emulation and sensitivity analysis of wafer warpage after reconstitution in fan-out packaging

研究成果: Conference contribution

4 引文 斯高帕斯(Scopus)

摘要

Wafer reconstitution fan-out is a vital process for serving as a buffer to decouple the processing developments between IC fabrication and electronics packaging. By this approach, the IC packaging is then independent from the chip processing. However, such a process brings numerous mechanical loadings during molding and curing phases. In this work, it is desired to examine the key factor of reconstituted wafer warpage by performing solid thermo-mechanical analyses. To have a deeper insight, simplified 2D and detailed 3D finite element analyses have been constructed to mimic the entire Recon process. Detail thermo-mechanical processing steps are then emulated by these finite element models. After model validation, systematic parametric studies are then performed to investigate the controlling factors for dominating the wafer warpage. The simulation results indicated that the thermal expansion coefficients and the Young's modulus of molding compounds could be the dominated factor. By choosing compounds with more desirable above-mentioned mechanical properties, it is expected that a 20 to 30 percentage reduction of warpage can be achieved.

原文English
主出版物標題2019 International Conference on Electronics Packaging, ICEP 2019
發行者Institute of Electrical and Electronics Engineers Inc.
頁面355-360
頁數6
ISBN(電子)9784990218867
DOIs
出版狀態Published - 2019 4月
事件2019 International Conference on Electronics Packaging, ICEP 2019 - Niigata, Japan
持續時間: 2019 4月 172019 4月 20

出版系列

名字2019 International Conference on Electronics Packaging, ICEP 2019

Conference

Conference2019 International Conference on Electronics Packaging, ICEP 2019
國家/地區Japan
城市Niigata
期間19-04-1719-04-20

All Science Journal Classification (ASJC) codes

  • 電氣與電子工程
  • 電子、光磁材料
  • 金屬和合金

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