Thermo-mechanical process emulation and sensitivity analysis of wafer warpage after reconstitution in fan-out packaging

Cheng Ying Yang, Kuo Shen Chen, Tian Shian G. Yang, Tz Cheng Chiu, Ching Jenq Ho

研究成果: Conference contribution

4 引文 斯高帕斯（Scopus）

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Engineering & Materials Science

Chemical Compounds