Thermoelectric Performance of Bi0.5Sb1.5Te3/Sb Composites Fabricated by Electroless Plating and Spark Plasma Sintering

F. R. Sie, Chii-Shyang Hwang, C. H. Kuo, Y. W. Chou, C. H. Yeh, H. Y. Ho, Y. L. Lin, C. H. Lan

研究成果: Article同行評審

3 引文 斯高帕斯(Scopus)

摘要

This study reports semi-metal/semi-conductor composites with enhanced thermoelectric performance that results from interface effects between Sb clusters and the Bi0.5Sb1.5Te3 matrix. The Sb clusters were dispersed on the surface of Bi0.5Sb1.5Te3 powders by electroless plating and then the powders were rapidly compacted by spark plasma sintering at 673 K and 50 MPa. The thermoelectric properties for Bi0.5Sb1.5Te3 and Bi0.5Sb1.5Te3/Sb bulk samples were measured in the temperature range of 300 K to 500 K. The electrical conductivity of Bi0.5Sb1.5Te3/Sb composites was enhanced at room temperature due to the increase in carrier concentration with increasing Sb content. The enhancement in the power factor of Bi0.5Sb1.5Te3/Sb composites was due to a high Seebeck coefficient at high measured temperature. Moreover, the Sb clusters acted as effective phonon scattering centers, which decreased the lattice thermal conductivity at high temperature. In comparison with Bi0.5Sb1.5Te3, the maximum value of ZT for Bi0.5Sb1.5Te3/Sb (2.8 wt.%) samples was enhanced from 0.21 to 0.54 at 500 K. Consequently, the optimal operation temperature of Bi0.5Sb1.5Te3/Sb composites shifted to higher temperature compared to that for Bi0.5Sb1.5Te3 bulk.

原文English
頁(從 - 到)1498-1503
頁數6
期刊Journal of Electronic Materials
44
發行號6
DOIs
出版狀態Published - 2015 六月 1

All Science Journal Classification (ASJC) codes

  • 電子、光磁材料
  • 凝聚態物理學
  • 電氣與電子工程
  • 材料化學

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