The results of Part I of this work are extended to laminated plates. It is assumed that the plates are, at most, macroscopically orthotropic, and that they are subjected to a uniform change in temperature and to in-plane mechanical loads. Average stresses and microstress fields are evaluated in each layer of the plate. Failure envelopes based on critical magnitudes of interface and axial matrix stresses are constructed for one of the SiC/TiAlNb systems of Part I.
All Science Journal Classification (ASJC) codes
- 工程 (全部)