Three dimensional mixed convection in a vertical enclosure with buoyancy assisted through-flow

Chin-Hsiang Cheng, Chun Jen Weng, Win Aung

研究成果: Conference contribution

摘要

A three-dimensional numerical and analytical study has been carried out for buoyancy assisted mixed convection in a rectangular vertical duct. The numerical approach is based on the use of a parabolic boundary layer model. A modified version of the FLARE method was employed for the study of three-dimensional mixed convection. Analytical solutions of the fully developed flows are also presented.

原文English
主出版物標題Advances in Electronic Packaging
頁面807-816
頁數10
10-2
出版狀態Published - 1995
事件Proceedings of the International Intersociety Electronic Packaging Conference - INTERpack'95. Part 1 (of 2) - Maui, HI, USA
持續時間: 1995 三月 261995 三月 30

Other

OtherProceedings of the International Intersociety Electronic Packaging Conference - INTERpack'95. Part 1 (of 2)
城市Maui, HI, USA
期間95-03-2695-03-30

    指紋

All Science Journal Classification (ASJC) codes

  • Mechanical Engineering
  • Electrical and Electronic Engineering

引用此

Cheng, C-H., Weng, C. J., & Aung, W. (1995). Three dimensional mixed convection in a vertical enclosure with buoyancy assisted through-flow. 於 Advances in Electronic Packaging (卷 10-2, 頁 807-816)