Three dimensional mixed convection in a vertical enclosure with buoyancy assisted through-flow

Chin-Hsiang Cheng, Chun Jen Weng, Win Aung

研究成果: Conference contribution

摘要

A three-dimensional numerical and analytical study has been carried out for buoyancy assisted mixed convection in a rectangular vertical duct. The numerical approach is based on the use of a parabolic boundary layer model. A modified version of the FLARE method was employed for the study of three-dimensional mixed convection. Analytical solutions of the fully developed flows are also presented.

原文English
主出版物標題Advances in Electronic Packaging
頁面807-816
頁數10
10-2
出版狀態Published - 1995
事件Proceedings of the International Intersociety Electronic Packaging Conference - INTERpack'95. Part 1 (of 2) - Maui, HI, USA
持續時間: 1995 三月 261995 三月 30

Other

OtherProceedings of the International Intersociety Electronic Packaging Conference - INTERpack'95. Part 1 (of 2)
城市Maui, HI, USA
期間95-03-2695-03-30

指紋

Mixed convection
Buoyancy
Enclosures
Ducts
Boundary layers

All Science Journal Classification (ASJC) codes

  • Mechanical Engineering
  • Electrical and Electronic Engineering

引用此文

Cheng, C-H., Weng, C. J., & Aung, W. (1995). Three dimensional mixed convection in a vertical enclosure with buoyancy assisted through-flow. 於 Advances in Electronic Packaging (卷 10-2, 頁 807-816)
Cheng, Chin-Hsiang ; Weng, Chun Jen ; Aung, Win. / Three dimensional mixed convection in a vertical enclosure with buoyancy assisted through-flow. Advances in Electronic Packaging. 卷 10-2 1995. 頁 807-816
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Cheng, C-H, Weng, CJ & Aung, W 1995, Three dimensional mixed convection in a vertical enclosure with buoyancy assisted through-flow. 於 Advances in Electronic Packaging. 卷 10-2, 頁 807-816, Proceedings of the International Intersociety Electronic Packaging Conference - INTERpack'95. Part 1 (of 2), Maui, HI, USA, 95-03-26.

Three dimensional mixed convection in a vertical enclosure with buoyancy assisted through-flow. / Cheng, Chin-Hsiang; Weng, Chun Jen; Aung, Win.

Advances in Electronic Packaging. 卷 10-2 1995. p. 807-816.

研究成果: Conference contribution

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Cheng C-H, Weng CJ, Aung W. Three dimensional mixed convection in a vertical enclosure with buoyancy assisted through-flow. 於 Advances in Electronic Packaging. 卷 10-2. 1995. p. 807-816