Through-Silicon via Submount for Flip-Chip LEDs

Chun Liang Lu, Shoou Jinn Chang, Wei Shou Chen, Ting Jen Hsueh

研究成果: Article同行評審

5 引文 斯高帕斯(Scopus)

指紋

深入研究「Through-Silicon via Submount for Flip-Chip LEDs」主題。共同形成了獨特的指紋。

Chemical Compounds

Engineering & Materials Science